Issued Patents All Time
Showing 76–100 of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7273804 | Internally reinforced bond pads | David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel McKnight +4 more | 2007-09-25 |
| 7273806 | Forming of high aspect ratio conductive structure using injection molded solder | Robert A. Groves, Peter A. Gruber, Richard P. Volant, George F. Walker | 2007-09-25 |
| 7115997 | Seedless wirebond pad plating | Chandrasekhar Narayan | 2006-10-03 |
| 7068138 | High Q factor integrated circuit inductor | Daniel C. Edelstein, Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, John Harold Magerlein +2 more | 2006-06-27 |
| 7056837 | Process of insulating a semiconductor device using a polymeric material | John M. Cotte, Kenneth McCullough, Wayne M. Moreau, John P. Simons, Charles J. Taft +1 more | 2006-06-06 |
| 7053460 | Multi-level RF passive device | Richard P. Volant, Seshadri Subbanna, Robert A. Groves, John C. Malinowski, Kenneth J. Stein | 2006-05-30 |
| 6995475 | I/C chip suitable for wire bonding | Julie C. Biggs, Tien-Jen Cheng, David E. Eichstadt, Lisa A. Fanti, Jonathan H. Griffith +6 more | 2006-02-07 |
| 6992368 | Production of metal insulator metal (MIM) structures using anodizing process | Richard P. Volant, John M. Cotte, Kenneth J. Stein | 2006-01-31 |
| 6982493 | Wedgebond pads having a nonplanar surface structure | Richard P. Volant | 2006-01-03 |
| 6943451 | Semiconductor devices containing a discontinuous cap layer and methods for forming same | Stanley Joseph Whitehair, Stephen M. Gates, Sampath Purushothaman, Satyanarayana V. Nitta, Maurice McGlashan-Powell | 2005-09-13 |
| 6927472 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu +3 more | 2005-08-09 |
| 6924185 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu +3 more | 2005-08-02 |
| 6873027 | Encapsulated energy-dissipative fuse for integrated circuits and method of making the same | Timothy J. Dalton, Richard P. Volant | 2005-03-29 |
| 6864578 | Internally reinforced bond pads | David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel McKnight +4 more | 2005-03-08 |
| 6831363 | Structure and method for reducing thermo-mechanical stress in stacked vias | Timothy J. Dalton, Sanjit Das, Brett H. Engel, Brian Herbst, Habib Hichri +8 more | 2004-12-14 |
| 6825075 | Method of fabricating MIM capacitor with the encapsulated metal structure serving as the lower plate | Donald F. Canaperi, Mahadevaiyer Krishnan, Kenneth J. Stein, Richard P. Volant | 2004-11-30 |
| 6819000 | High density area array solder microjoining interconnect structure and fabrication method | John Harold Magerlein, Sampath Purushothaman, Carlos J. Sambucetti, Richard P. Volant, George F. Walker | 2004-11-16 |
| 6815813 | Self-contained heat sink and a method for fabricating same | Timothy J. Dalton, Michelle L. Steen, Cornelia K. Tsang, Richard P. Volant | 2004-11-09 |
| 6800503 | MEMS encapsulated structure and method of making same | Joseph T. Kocis, James A. Tornello, Richard P. Volant, Seshadri Subbanna | 2004-10-05 |
| 6798029 | Method of fabricating micro-electromechanical switches on CMOS compatible substrates | Richard P. Volant, John C. Bisson, Donna R. Cote, Timothy J. Dalton, Robert A. Groves +2 more | 2004-09-28 |
| 6762667 | Micro electromechanical switch having self-aligned spacers | Richard P. Volant, David Angell, Donald F. Canaperi, Joseph T. Kocis, Kenneth J. Stein +1 more | 2004-07-13 |
| 6756624 | Encapsulated metal structures for semiconductor devices and MIM capacitors including the same | Donald F. Canaperi, Mahadevaiyer Krishnan, Kenneth J. Stein, Richard P. Volant | 2004-06-29 |
| 6747472 | Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same | John Harold Magerlein, Samuel McKnight, Sampath Purushothaman, Carlos J. Sambucetti, Joseph J. Van Horn +2 more | 2004-06-08 |
| 6737725 | Multilevel interconnect structure containing air gaps and method for making | Alfred Grill, Jeffrey Hedrick, Christopher V. Jahnes, Satyanarayana V. Nitta, Sampath Purushothaman +2 more | 2004-05-18 |
| 6732908 | High density raised stud microjoining system and methods of fabricating the same | Bruce K. Furman, Maheswaran Surendra, Sherif A. Goma, Simon Karecki, John Harold Magerlein +4 more | 2004-05-11 |