KP

Kevin S. Petrarca

IBM: 120 patents #414 of 70,183Top 1%
📍 Newburgh, NY: #2 of 198 inventorsTop 2%
🗺 New York: #383 of 115,490 inventorsTop 1%
Overall (All Time): #9,954 of 4,157,543Top 1%
120
Patents All Time

Issued Patents All Time

Showing 101–120 of 120 patents

Patent #TitleCo-InventorsDate
6701779 Perpendicular torsion micro-electromechanical switch Richard P. Volant, Robert A. Groves, David M. Rockwell, Kenneth J. Stein 2004-03-09
6661098 High density area array solder microjoining interconnect structure and fabrication method John Harold Magerlein, Sampath Purushothaman, Carlos J. Sambucetti, Richard P. Volant, George F. Walker 2003-12-09
6656369 Method for fabricating a scanning probe microscope probe Mahadevaiyer Krishnan, Mark E. Lagus, James G. Ryan, Richard P. Volant 2003-12-02
6635506 Method of fabricating micro-electromechanical switches on CMOS compatible substrates Richard P. Volant, John C. Bisson, Donna R. Cote, Timothy J. Dalton, Robert A. Groves +2 more 2003-10-21
6621392 Micro electromechanical switch having self-aligned spacers Richard P. Volant, David Angell, Donald F. Canaperi, Joseph T. Kocis, Kenneth J. Stein +1 more 2003-09-16
6613641 Production of metal insulator metal (MIM) structures using anodizing process Richard P. Volant, John M. Cotte, Kenneth J. Stein 2003-09-02
6597068 Encapsulated metal structures for semiconductor devices and MIM capacitors including the same Donald F. Canaperi, Mahadevaiyer Krishnan, Kenneth J. Stein, Richard P. Volant 2003-07-22
6534863 Common ball-limiting metallurgy for I/O sites George F. Walker, Ronald D. Goldblatt, Peter A. Gruber, Raymond R. Horton, Richard P. Volant +1 more 2003-03-18
6489857 Multiposition micro electromechanical switch Robert A. Groves, Brian Herbst, Christopher V. Jahnes, Richard P. Volant 2002-12-03
6448629 Semiconductor device and method of making same Rebecca D. Mih 2002-09-10
6429522 Microprocessor having air as a dielectric and encapsulated lines Rebecca D. Mih 2002-08-06
6413852 Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material Alfred Grill, Jeffrey Hedrick, Christopher V. Jahnes, Satyanarayana V. Nitta, Sampath Purushothaman +2 more 2002-07-02
6383893 Method of forming a crack stop structure and diffusion barrier in integrated circuits Edward Sumner Begle, Richard P. Volant 2002-05-07
6368484 Selective plating process Richard P. Volant, Peter S. Locke, David M. Rockwell, Seshadri Subbanna 2002-04-09
6368953 Encapsulated metal structures for semiconductor devices and MIM capacitors including the same Donald F. Canaperi, Mahadevaiyer Krishnan, Kenneth J. Stein, Richard P. Volant 2002-04-09
6344125 Pattern-sensitive electrolytic metal plating Peter S. Locke, Seshadri Subbanna, Richard P. Volant 2002-02-05
6339024 Reinforced integrated circuits John E. Heidenreich, III, Judith M. Rubino, Carlos J. Sambucetti, Richard P. Volant, George F. Walker 2002-01-15
6284574 Method of producing heat dissipating structure for semiconductor devices Sarah H. Knickerbocker, Joyce C. Liu, Rebecca D. Mih 2001-09-04
6268261 Microprocessor having air as a dielectric and encapsulated lines and process for manufacture Rebecca D. Mih 2001-07-31
6258732 Method of forming a patterned organic dielectric layer on a substrate Qinghuang Lin, Rebecca D. Mih 2001-07-10