Issued Patents All Time
Showing 26–50 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9159602 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | Paul S. Andry, John U. Knickerbocker, Cornelia K. Tsang | 2015-10-13 |
| 8889537 | Implantless dopant segregation for silicide contacts | Cryil Cabral, Jr., Dinesh R. Koli, Laura L. Kosbar, Mahadevaiyer Krishnan, Christian Lavoie +2 more | 2014-11-18 |
| 8865597 | Ta—TaN selective removal process for integrated device fabrication | Nils D. Hoivik, Christopher V. Jahnes, Robert L. Wisnieff | 2014-10-21 |
| 8828143 | Apparatus and method for the rapid thermal control of a work piece in liquid or supercritical fluid | John P. Simons, Kenneth McCullough, Wayne M. Moreau, Keith R. Pope, Charles J. Taft +1 more | 2014-09-09 |
| 8796138 | Through substrate vias | Christopher V. Jahnes, Bucknell C. Webb | 2014-08-05 |
| 8795502 | Electrodeposition under illumination without electrical contacts | Harold J. Hovel, Devendra K. Sadana, Xiaoyan Shao, Steven E. Steen | 2014-08-05 |
| 8604337 | Method to evaluate effectiveness of substrate cleanness and quantity of pin holes in an antireflective coating of a solar cell | Laura L. Kosbar, Deborah A. Neumayer, Xiaoyan Shao | 2013-12-10 |
| 8592932 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | Paul S. Andry, John U. Knickerbocker, Cornelia K. Tsang | 2013-11-26 |
| 8541854 | Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure | Nils D. Hoivik, Christopher V. Jahnes, Minhua Lu, Hongqing Zhang | 2013-09-24 |
| 8524606 | Chemical mechanical planarization with overburden mask | Leslie M. Charns, Jason E. Cummings, Lukasz J. Hupka, Dinesh R. Koli, Tomohisa Konno +6 more | 2013-09-03 |
| 8519260 | Method to evaluate effectiveness of substrate cleanness and quantity of pin holes in an antireflective coating of a solar cell | Laura L. Kosbar, Deborah A. Neumayer, Xiaoyan Shao | 2013-08-27 |
| 8492899 | Method to electrodeposit nickel on silicon for forming controllable nickel silicide | Cyril Cabral, Jr., Kathryn C. Fisher, Laura L. Kosbar, Christian Lavoie, Zhu Liu +1 more | 2013-07-23 |
| 8448790 | Surface charge enabled nanoporous semi-permeable membrane for desalination | Christopher V. Jahnes, Hongbo Peng, Stephen M. Rossnagel | 2013-05-28 |
| 8426316 | Ta-TaN selective removal process for integrated device fabrication | Nils D. Hoivik, Christopher V. Jahnes, Robert L. Wisnieff | 2013-04-23 |
| 8388758 | Apparatus and method for the rapid thermal control of a work piece in liquid or supercritical fluid | John P. Simons, Kenneth McCullough, Wayne M. Moreau, Keith R. Pope, Charles J. Taft +1 more | 2013-03-05 |
| 8354737 | Small area, robust silicon via structure and process | Paul S. Andry, John U. Knickerbocker, Cornelia K. Tsang | 2013-01-15 |
| 8338920 | Package integrated soft magnetic film for improvement in on-chip inductor performance | Hanyi Ding, Kai D. Feng, Zhong-Xiang He, Nils D. Hoivik, Xuefeng Liu | 2012-12-25 |
| 8307994 | Surface charge enabled nanoporous semi-permeable membrane for desalination | Christopher V. Jahnes, Hongbo Peng, Stephen M. Rossnagel | 2012-11-13 |
| 8303791 | Apparatus and method for electrochemical processing of thin films on resistive substrates | Veeraraghavan S. Basker, Hariklia Deligianni, Matteo Flotta | 2012-11-06 |
| 8293643 | Method and structure of forming silicide and diffusion barrier layer with direct deposited film on silicon | Cyril Cabral, Jr., Kathryn C. Fisher, Laura L. Kosbar, Christian Lavoie, Zhu Liu +2 more | 2012-10-23 |
| 8263497 | High-yield method of exposing and contacting through-silicon vias | Paul S. Andry, Michael F. Lofaro, Edmund J. Sprogis, James A. Tornello, Cornelia K. Tsang | 2012-09-11 |
| 8263492 | Through substrate vias | Christopher V. Jahnes, Bucknell C. Webb | 2012-09-11 |
| 8163584 | Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure | Minhua Lu, Nils D. Hoivik, Christopher V. Jahnes, Hongqing Zhang | 2012-04-24 |
| 8093679 | Integrated BEOL thin film resistor | Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Anthony K. Stamper +1 more | 2012-01-10 |
| 8012796 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | Paul S. Andry, John U. Knickerbocker, Cornelia K. Tsang | 2011-09-06 |