Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9263517 | Extremely thin semiconductor-on-insulator (ETSOI) layer | Wagdi W. Abadeer, Kiran V. Chatty, Toshiharu Furukawa, Robert J. Gauthier, Jr., Jed H. Rankin +2 more | 2016-02-16 |
| 9018024 | Creating extremely thin semiconductor-on-insulator (ETSOI) having substantially uniform thickness | Nathaniel Berliner, Kangguo Cheng, Toshiharu Furukawa, Jed H. Rankin, Robert R. Robison +1 more | 2015-04-28 |
| 8790991 | Method and structure for shallow trench isolation to mitigate active shorts | Balasubramanian S. Haran, Hemanth Jagannathan, Sanjay C. Mehta | 2014-07-29 |
| 8679941 | Method to improve wet etch budget in FEOL integration | Lisa F. Edge, Balasubramanian S. Haran, David V. Horak, Hemanth Jagannathan, Sanjay C. Mehta | 2014-03-25 |
| 8524606 | Chemical mechanical planarization with overburden mask | Leslie M. Charns, John M. Cotte, Lukasz J. Hupka, Dinesh R. Koli, Tomohisa Konno +6 more | 2013-09-03 |
| 8513127 | Chemical mechanical planarization processes for fabrication of FinFET devices | Josephine B. Chang, Leslie M. Charns, Michael A. Guillorn, Lukasz J. Hupka, Dinesh R. Koli +7 more | 2013-08-20 |
| 8507383 | Fabrication of replacement metal gate devices | Takashi Ando, Leslie M. Charns, Lukasz J. Hupka, Dinesh R. Koli, Tomohisa Konno +6 more | 2013-08-13 |
| 8497210 | Shallow trench isolation chemical mechanical planarization | Leslie M. Charns, Lukasz J. Hupka, Dinesh R. Koli, Tomohisa Konno, Mahadevaiyer Krishnan +5 more | 2013-07-30 |
| 8232179 | Method to improve wet etch budget in FEOL integration | Lisa F. Edge, Balasubramanian S. Haran, David V. Horak, Hemanth Jagannathan, Sanjay C. Mehta | 2012-07-31 |
| 8110483 | Forming an extremely thin semiconductor-on-insulator (ETSOI) layer | Wagdi W. Abadeer, Kiran V. Chatty, Toshiharu Furukawa, Robert J. Gauthier, Jr., Jed H. Rankin +2 more | 2012-02-07 |