Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dielectric interposer for chip to substrate soldering

Dielectric interposer for chip to substrate soldering

US Patent 6657313 · Granted Dec 2, 2003

Estimated economic value: $4,756,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Infrared debond damage mitigation by copper fill pattern2025
Electronic substrate stacking2024
Multi-sensor platform for health monitoring2024
High density interconnection and wiring layers, package structures, and integrat2024
Multiple die assembly2024
Wearable multiplatform sensor2024
Silicon handler with laser-release layers2024
Thin film battery stacking2024
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protec2023
Molten solder injection head with vacuum filter and differential gauge system2023
Precision thin electronics handling integration2023
Method of forming thin die stack assemblies2023