FL

Fengyuan Lai

Lam Research: 7 patents #410 of 2,128Top 20%
IBM: 2 patents #32,839 of 70,183Top 50%
RI Rensselaer Polytechnic Institute: 1 patents #306 of 819Top 40%
📍 Sherwood, OR: #48 of 276 inventorsTop 20%
🗺 Oregon: #4,682 of 28,073 inventorsTop 20%
Overall (All Time): #532,122 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
12227837 Ex situ coating of chamber components for semiconductor processing Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more 2025-02-18
12163219 Ex situ coating of chamber components for semiconductor processing Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more 2024-12-10
11761079 Oxidation resistant protective layer in chamber conditioning Bo Gong, Guangbi Yuan, Chen-Hua Hsu, Bhadri N. Varadarajan 2023-09-19
11365479 Ex situ coating of chamber components for semiconductor processing Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more 2022-06-21
10760158 Ex situ coating of chamber components for semiconductor processing Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more 2020-09-01
10297442 Remote plasma based deposition of graded or multi-layered silicon carbide film Bhadri N. Varadarajan, Bo Gong, Guangbi Yuan, Zhe Gui 2019-05-21
9837270 Densification of silicon carbide film using remote plasma treatment Bhadri N. Varadarajan, Bo Gong, Guangbi Yuan, Zhe Gui 2017-12-05
9512291 High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites Theodorian Borca-Tasciuc, Sushumna Iruvanti, Kamyar Pashayi, Joel L. Plawsky, Hafez Raeisi-Fard 2016-12-06
9045674 High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites Sushumna Iruvanti, Theodorian Borca-Tasciuc, Hafez Raeisi-Fard, Kamyar Pashayi, Joel L. Plawsky 2015-06-02