HR

Hafez Raeisi-Fard

IBM: 2 patents #32,839 of 70,183Top 50%
RI Rensselaer Polytechnic Institute: 1 patents #306 of 819Top 40%
📍 Troy, NY: #247 of 610 inventorsTop 45%
🗺 New York: #48,759 of 115,490 inventorsTop 45%
Overall (All Time): #2,018,743 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9512291 High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites Theodorian Borca-Tasciuc, Sushumna Iruvanti, Fengyuan Lai, Kamyar Pashayi, Joel L. Plawsky 2016-12-06
9045674 High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites Sushumna Iruvanti, Theodorian Borca-Tasciuc, Fengyuan Lai, Kamyar Pashayi, Joel L. Plawsky 2015-06-02