NB

Nicolas Boyer

IBM: 11 patents #9,995 of 70,183Top 15%
Overall (All Time): #457,672 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10338325 Nanofiller in an optical interface Barnim Alexander Janta-Polczynski, Tymon Barwicz, Elaine Cyr, Marie-Claude Paquet, Richard Langlois +1 more 2019-07-02
10302869 Optical interconnect attach to photonic device with partitioning adhesive function Barnim Alexander Janta-Polczynski, Elaine Cyr, Tymon Barwicz, Richard Langlois, Paul F. Fortier 2019-05-28
10295749 Optical interconnect attach to photonic device with partitioning adhesive function Barnim Alexander Janta-Polczynski, Elaine Cyr, Tymon Barwicz, Richard Langlois, Paul F. Fortier 2019-05-21
9810864 Fiber pigtail assembly with integrated lid enabling optical fiber mobility Tymon Barwicz, Paul F. Fortier, Alexander Janta-Polczynski 2017-11-07
9684133 Component assembly apparatus Tymon Barwicz, Guy Brouilette, Paul F. Fortier, Stephane Harel, Roch Thivierge 2017-06-20
9662830 Bondline control fixture and method of affixing first and second components Tymon Barwicz, Paul F. Fortier, Stephane Harel, Roch Thivierge 2017-05-30
9656420 Bondline control fixture and method of affixing first and second components Tymon Barwicz, Paul F. Fortier, Stephane Harel, Roch Thivierge 2017-05-23
9651747 Fiber pigtail assembly with integrated lid enabling optical fiber mobility Tymon Barwicz, Paul F. Fortier, Alexander Janta-Polczynski 2017-05-16
9568682 Component and chip assembly structure for high yield parallelized fiber assembly Tymon Barwicz, Paul F. Fortier, Alexander Janta-Polczynski, Stephan L. Martel, Jean-Francois Morissette 2017-02-14
9338935 System for removing an electronic component from a substrate Yvan Bessette, Eric Bouchard, Camille Dube, Eric Dube, Sarah Turgeon 2016-05-10
8925170 Method for removing an electronic component from a substrate Yvan Bessette, Eric Bouchard, Camille Dube, Eric Dube, Sarah Turgeon 2015-01-06