Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10969222 | Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect | Elaine Cyr, Dominique L. Demers, Paul F. Fortier | 2021-04-06 |
| 10754070 | Microlens array assembling process | Koji Masuda, Patrick Jacques, Vincent Langlois, Paul F. Fortier | 2020-08-25 |
| 10073223 | Connecting mid-board optical modules | Tymon Barwicz, Jerome Bougie, Darrell R. Childers, Paul F. Fortier, Stephan L. Martel | 2018-09-11 |
| 9897444 | Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect | Elaine Cyr, Dominique L. Demers, Paul F. Fortier | 2018-02-20 |
| 9835804 | Connecting mid-board optical modules | Tymon Barwicz, Jerome Bougie, Darrell R. Childers, Paul F. Fortier, Stephan L. Martel | 2017-12-05 |
| 9810864 | Fiber pigtail assembly with integrated lid enabling optical fiber mobility | Tymon Barwicz, Nicolas Boyer, Paul F. Fortier | 2017-11-07 |
| 9720188 | Connecting mid-board optical modules | Tymon Barwicz, Jerome Bougie, Darrell R. Childers, Paul F. Fortier, Stephan L. Martel | 2017-08-01 |
| 9706670 | Connecting mid-board electronic devices | Tymon Barwicz, Jerome Bougie, Paul F. Fortier, Stephan L. Martel | 2017-07-11 |
| 9651747 | Fiber pigtail assembly with integrated lid enabling optical fiber mobility | Tymon Barwicz, Nicolas Boyer, Paul F. Fortier | 2017-05-16 |
| 9568682 | Component and chip assembly structure for high yield parallelized fiber assembly | Tymon Barwicz, Nicolas Boyer, Paul F. Fortier, Stephan L. Martel, Jean-Francois Morissette | 2017-02-14 |