Issued Patents All Time
Showing 26–50 of 148 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8823164 | Heatsink attachment module | Evan G. Colgan, Jeffrey A. Zitz | 2014-09-02 |
| 8815725 | Low alpha particle emission electrically-conductive coating | Michael S. Gordon, Eric P. Lewandowski | 2014-08-26 |
| 8785217 | Tunable radiation source | Michael S. Gordon, Nancy C. LaBianca, Kenneth P. Rodbell | 2014-07-22 |
| 8772927 | Semiconductor package structures having liquid cooler integrated with first level chip package modules | Raschid J. Bezama, Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei | 2014-07-08 |
| 8693200 | Semiconductor device cooling module | Evan G. Colgan, Jeffrey A. Zitz | 2014-04-08 |
| 8651359 | Flip chip bonder head for forming a uniform fillet | Jae-Woong Nah | 2014-02-18 |
| 8614900 | Grounded lid for micro-electronic assemblies | Martin Beaumier, Alexandre Blander, Pascale Gagnon, Eric Giguere, Eric Salvas +1 more | 2013-12-24 |
| 8589102 | Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures | Timothy J. Chainer, Edward J. Yarmchuk | 2013-11-19 |
| 8411444 | Thermal interface material application for integrated circuit cooling | Dong G. Kam, Duixian Liu, Scott K. Reynolds | 2013-04-02 |
| 8293141 | Electronic device comprising electrically stable copper filled electrically conductive adhesive | Jeffrey D. Gelorme, Luis J. Matienzo, Rebecca Suzanne Northey, Michael B. Vincent | 2012-10-23 |
| 8288177 | SER testing for an IC chip using hot underfill | Michael S. Gordon, Nancy C. LaBianca, Kenneth F. Latzko, Aparna Prabhakar | 2012-10-16 |
| 8268389 | Precast thermal interface adhesive for easy and repeated, separation and remating | Evan G. Colgan, Paul W. Coteus, Kenneth C. Marston, Steven P. Ostrander | 2012-09-18 |
| 8269340 | Curvilinear heat spreader/lid with improved heat dissipation | Maurice McGlashan-Powell, Soojae Park, Edward J. Yarmchuk | 2012-09-18 |
| 8115303 | Semiconductor package structures having liquid coolers integrated with first level chip package modules | Raschid J. Bezama, Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei | 2012-02-14 |
| 8037594 | Method of forming a flip-chip package | Jeffrey T. Coffin, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil | 2011-10-18 |
| 8026730 | Process for measuring heat spreader tilt | Edward J. Yarmchuk | 2011-09-27 |
| 8008122 | Pressurized underfill cure | Jae-Woong Nah, Satoru Katsurayama | 2011-08-30 |
| 7808781 | Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements | Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Roger R. Schmidt, Hilton T. Toy | 2010-10-05 |
| 7786588 | Composite interconnect structure using injection molded solder technique | David Danovitch, Mukta G. Farooq | 2010-08-31 |
| 7764069 | Process for measuring bond-line thickness | Edward J. Yarmchuk | 2010-07-27 |
| 7763188 | Electrically stable copper filled electrically conductive adhesive | Jeffrey D. Gelorme, Luis J. Matienzo, Rebecca Suzanne Northey, Michael B. Vincent | 2010-07-27 |
| 7740713 | Flux composition and techniques for use thereof | Eric Duchesne, Timothy A. Gosselin, Kang-Wook Lee, Valerie Oberson | 2010-06-22 |
| 7645410 | Thermoplastic adhesive preform for heat sink attachment | John G. Davis, Joseph D. Poole | 2010-01-12 |
| 7504718 | Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain | Kathleen C. Hinge, John U. Knickerbocker | 2009-03-17 |
| 7489512 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Jeffrey T. Coffin, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil | 2009-02-10 |