Issued Patents All Time
Showing 76–100 of 148 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617698 | Reworkable and thermally conductive adhesive and use thereof | Stephen L. Buchwalter, Nancy C. LaBianca, Stefano S. Oggioni, Son K. Tran | 2003-09-09 |
| 6576996 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2003-06-10 |
| 6559666 | Method and device for semiconductor testing using electrically conductive adhesives | William E. Bernier, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik | 2003-05-06 |
| 6545226 | Printed wiring board interposer sub-assembly | William L. Brodsky, Benson Chan, Voya R. Markovich | 2003-04-08 |
| 6545869 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Barry A. Bonitz, Eric Duchesne, Eric A. Johnson | 2003-04-08 |
| 6531343 | Method of encapsulating a circuit assembly | Kenneth Raymond Carter, Craig J. Hawker, James L. Hedrick, Robert D. Miller, Stephen L. Buchwalter | 2003-03-11 |
| 6517662 | Process for making semiconductor chip assembly | Thomas M. Culnane, Ramesh R. Kodnani, Mark V. Pierson, Charles G. Woychik | 2003-02-11 |
| 6512295 | Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses | Eric A. Johnson | 2003-01-28 |
| 6495771 | Compliant multi-layered circuit board for PBGA applications | Eric A. Johnson | 2002-12-17 |
| 6492724 | Structure for reinforcing a semiconductor device to prevent cracking | Mark V. Pierson, Aleksander Zubelewicz | 2002-12-10 |
| 6487461 | TFT panel alignment and attachment method and apparatus | Allan O. Johnson, Ramesh R. Kodnani, Mark V. Pierson, Edward J. Tasillo | 2002-11-26 |
| 6447885 | Bonding together surfaces | Ramesh R. Kodnani | 2002-09-10 |
| 6432511 | Thermoplastic adhesive preform for heat sink attachment | John G. Davis, Joseph D. Poole | 2002-08-13 |
| 6427323 | Method for producing conductor interconnect with dendrites | Bernd Karl Appelt, Saswati Datta, John M. Lauffer, James R. Wilcox | 2002-08-06 |
| 6410988 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Jean Dery, Eric Duchesne, Eric A. Johnson, Luis J. Matienzo +1 more | 2002-06-25 |
| 6403882 | Protective cover plate for flip chip assembly backside | William T. Chen, Eric A. Johnson, Tien Y. Wu | 2002-06-11 |
| 6369452 | Cap attach surface modification for improved adhesion | Stephen L. Buchwalter, Hung Manh Dang, Konstantinos I. Papathomas | 2002-04-09 |
| 6344099 | TFT panel alignment and attachment method and apparatus | Allan O. Johnson, Ramesh R. Kodnani, Mark V. Pierson, Edward J. Tasillo | 2002-02-05 |
| 6326237 | Reworkable thermoplastic hyper-branched encapsulant | Kenneth Raymond Carter, Craig J. Hawker, James L. Hedrick, Robert D. Miller, Stephen L. Buchwalter | 2001-12-04 |
| 6300575 | Conductor interconnect with dendrites through film | Bernd Karl Appelt, Saswati Datta, John M. Lauffer, James R. Wilcox | 2001-10-09 |
| 6288559 | Semiconductor testing using electrically conductive adhesives | William E. Bernier, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik | 2001-09-11 |
| 6268739 | Method and device for semiconductor testing using electrically conductive adhesives | William E. Bernier, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik | 2001-07-31 |
| 6256874 | Conductor interconnect with dendrites through film and method for producing same | Bernd Karl Appelt, Saswati Datta, John M. Lauffer, James R. Wilcox | 2001-07-10 |
| 6255208 | Selective wafer-level testing and burn-in | William E. Bernier, Claude L. Bertin, Anilkumar C. Bhatt, Erik L. Hedberg, Nikhil M. Murdeshwar +5 more | 2001-07-03 |
| 6252779 | Ball grid array via structure | Mark V. Pierson | 2001-06-26 |