Issued Patents All Time
Showing 126–148 of 148 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5910641 | Selectively filled adhesives for compliant, reworkable, and solder-free flip chip interconnection and encapsulation | Jaynal A. Molla | 1999-06-08 |
| 5889321 | Stiffeners with improved adhesion to flexible substrates | Thomas M. Culnane, Ramesh R. Kodnani, Mark V. Pierson | 1999-03-30 |
| 5875010 | Display panel having individual display devices bonded to light transmitting plates which have a combined area greater than of the devices | Jeffrey C. Baechtle, Mark V. Pierson, Anne Marie Quinn, David B. Stone | 1999-02-23 |
| 5875011 | Liquid crystal display tile interconnected to a tile carrier and method | Mark V. Pierson, David B. Stone, Thurston Bryce Youngs, Jr. | 1999-02-23 |
| 5866044 | Lead free conductive composites for electrical interconnections | Ravi F. Saraf, Judith Marie Roldan, Richard B. Booth, Steven P. Ostrander, Emanuel I. Cooper +1 more | 1999-02-02 |
| 5847929 | Attaching heat sinks directly to flip chips and ceramic chip carriers | William E. Bernier, Irving Memis, Hussain Shaukatuallah | 1998-12-08 |
| 5831828 | Flexible circuit board and common heat spreader assembly | Lawrence R. Cutting, Eric A. Johnson, Cynthia S. Milkovich, Jeffrey S. Perkins, Mark V. Pierson +2 more | 1998-11-03 |
| 5813870 | Selectively filled adhesives for semiconductor chip interconnection and encapsulation | Jaynal A. Molla, Steven P. Ostrander, Judith Marie Roldan, George J. Saxenmeyer, Jr., George F. Walker | 1998-09-29 |
| 5798050 | Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate | Jaynal A. Molla | 1998-08-25 |
| 5785799 | Apparatus for attaching heat sinks directly to chip carrier modules using flexible epoxy | Thomas M. Culnane, Ping Kwong Seto, Hussain Shaukatullah | 1998-07-28 |
| 5777705 | Wire bond attachment of a liquid crystal display tile to a tile carrier | Mark V. Pierson, Steven F. Arndt, Lawrence R. Cutting, David B. Stone | 1998-07-07 |
| 5759737 | Method of making a component carrier | Natalie B. Feilchenfeld, Stephen Joseph Fuerniss, Mark V. Pierson, Pat Hoontrakul | 1998-06-02 |
| 5759269 | Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture | Lawrence R. Cutting, Eric A. Johnson, Cynthia S. Milkovich, Jeffrey S. Perkins, Mark V. Pierson +2 more | 1998-06-02 |
| 5747101 | Direct chip attachment (DCA) with electrically conductive adhesives | Richard B. Booth, Robert M. Murcko, Viswanadham Puligandla, Judith Marie Roldan, Ravi F. Saraf +1 more | 1998-05-05 |
| 5744863 | Chip carrier modules with heat sinks attached by flexible-epoxy | Thomas M. Culnane, Ping Kwong Seto, Hussain Shaukatullah | 1998-04-28 |
| 5713508 | Stabilization of conductive adhesive by metallurgical bonding | Kostas Papathomas, Giana M. Phelan, Charles G. Woychik | 1998-02-03 |
| 5672548 | Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy | Thomas M. Culnane, Ping Kwong Seto, Hussain Shaukatullah | 1997-09-30 |
| 5638597 | Manufacturing flexible circuit board assemblies with common heat spreaders | Lawrence R. Cutting, Eric A. Johnson, Cynthia S. Milkovich, Jeffrey S. Perkins, Mark V. Pierson +2 more | 1997-06-17 |
| 5565033 | Pressurized injection nozzle for screening paste | George D. Oxx, Jr., Mark V. Pierson, Jerzy M. Zalesinski | 1996-10-15 |
| 5545465 | Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits | George D. Oxx, Jr., Mark V. Pierson, Jerzy M. Zalesinski | 1996-08-13 |
| 5543585 | Direct chip attachment (DCA) with electrically conductive adhesives | Richard B. Booth, Robert M. Murco, Viswanadham Puligandla, Judith Marie Roldan, Ravi F. Saraf +1 more | 1996-08-06 |
| 5542602 | Stabilization of conductive adhesive by metallurgical bonding | Kostas Papathomas, Giana M. Phelan, Charles G. Woychik | 1996-08-06 |
| 5478700 | Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head | George D. Oxx, Jr., Mark V. Pierson, Jerzy M. Zalesinski | 1995-12-26 |