Issued Patents All Time
Showing 101–125 of 148 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6251707 | Attaching heat sinks directly to flip chips and ceramic chip carriers | William E. Bernier, Irving Memis, Hussain Shaukatuallah | 2001-06-26 |
| 6236115 | High density integrated circuit packaging with chip stacking and via interconnections | Alan J. Emerick, Viswanadham Puligandla, Charles G. Woychik, Jerzy M. Zalesinski | 2001-05-22 |
| 6219238 | Structure for removably attaching a heat sink to surface mount packages | Frank E. Andros, Hussain Shaukatullah, Wayne R. Storr | 2001-04-17 |
| 6206997 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2001-03-27 |
| 6199751 | Polymer with transient liquid phase bondable particles | Kostas Papathomas, Giana M. Phelan, Charles G. Woychik | 2001-03-13 |
| 6197619 | Method for reinforcing a semiconductor device to prevent cracking | Mark V. Pierson, Aleksander Zubelewicz | 2001-03-06 |
| 6197222 | Lead free conductive composites for electrical interconnections | Ravi F. Saraf, Judith Marie Roldan, Richard B. Booth, Steven P. Ostrander, Emanuel I. Cooper +1 more | 2001-03-06 |
| 6193576 | TFT panel alignment and attachment method and apparatus | Allan O. Johnson, Ramesh R. Kodnani, Mark V. Pierson, Edward J. Tasillo | 2001-02-27 |
| 6187678 | High density integrated circuit packaging with chip stacking and via interconnections | Alan J. Emerick, Viswanadham Puligandla, Charles G. Woychik, Jerzy M. Zalesinski | 2001-02-13 |
| 6174406 | Bonding together surfaces | Ramesh R. Kodnani | 2001-01-16 |
| 6165885 | Method of making components with solder balls | Mark V. Pierson | 2000-12-26 |
| 6150726 | Component carrier with raised bonding sites | Natalie B. Feilchenfeld, Stephen Joseph Fuerniss, Mark V. Pierson, Pat Hoontrakul | 2000-11-21 |
| 6129804 | TFT panel alignment and attachment method and apparatus | Allan O. Johnson, Ramesh R. Kodnani, Mark V. Pierson, Edward J. Tasillo | 2000-10-10 |
| 6111323 | Reworkable thermoplastic encapsulant | Kenneth Raymond Carter, Craig J. Hawker, James L. Hedrick, Robert D. Miller, Stephen L. Buchwalter | 2000-08-29 |
| 6104093 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Jean Dery, Eric Duchesne, Eric A. Johnson, Luis J. Matienzo +1 more | 2000-08-15 |
| 6087021 | Polymer with transient liquid phase bondable particles | Kostas Papathomas, Giana M. Phelan, Charles G. Woychik | 2000-07-11 |
| 6069023 | Attaching heat sinks directly to flip chips and ceramic chip carriers | William E. Bernier, Irving Memis, Hussain Shaukatuallah | 2000-05-30 |
| 6043110 | Wire mesh insert for thermal adhesives | John G. Davis, Joseph D. Poole | 2000-03-28 |
| 6002177 | High density integrated circuit packaging with chip stacking and via interconnections | Alan J. Emerick, Viswanadham Puligandla, Charles G. Woychik, Jerzy M. Zalesinski | 1999-12-14 |
| 5998876 | Reworkable thermoplastic hyper-branched encapsulant | Kenneth Raymond Carter, Craig J. Hawker, James L. Hedrick, Robert D. Miller, Stephen L. Buchwalter | 1999-12-07 |
| 5977642 | Dendrite interconnect for planarization and method for producing same | Bernd Karl Appelt, Saswati Datta, John M. Lauffer, James R. Wilcox | 1999-11-02 |
| 5973389 | Semiconductor chip carrier assembly | Thomas M. Culnane, Ramesh R. Kodnani, Mark V. Pierson, Charles G. Woychik | 1999-10-26 |
| 5969945 | Electronic package assembly | Lawrence R. Cutting, Eric A. Johnson, Cynthia S. Milkovich, Jeffrey S. Perkins, Mark V. Pierson +2 more | 1999-10-19 |
| 5960251 | Organic-metallic composite coating for copper surface protection | Vista A. Brusic, Vijay S. Darekar, Ravi F. Saraf | 1999-09-28 |
| 5940687 | Wire mesh insert for thermal adhesives | John G. Davis, Joseph D. Poole | 1999-08-17 |