Issued Patents All Time
Showing 51–75 of 148 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7319591 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Jeffrey T. Coffin, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil | 2008-01-15 |
| 7252515 | Non-oriented wire in elastomer electrical contact | William L. Brodsky, William E. Buchler, Jr., Benson Chan | 2007-08-07 |
| 7238547 | Packaging integrated circuits for accelerated detection of transient particle induced soft error rates | Theodore H. Zabel, Michael S. Gordon, Nancy C. LaBianca, Jerry D. Ackaret | 2007-07-03 |
| 7204697 | Non-oriented wire in elastomer electrical contact | William L. Brodsky, William E. Buchler, Jr., Benson Chan | 2007-04-17 |
| 7176563 | Electronically grounded heat spreader | Eric Duchesne | 2007-02-13 |
| 7078802 | Method for bonding heat sinks to overmold material and resulting structure | William R. Hill | 2006-07-18 |
| 7064013 | Cap attach surface modification for improved adhesion | Stephen L. Buchwalter, Hung Manh Dang, Konstantinos I. Papathomas | 2006-06-20 |
| 6984286 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Barry A. Bonitz, Eric Duchesne, Eric A. Johnson | 2006-01-10 |
| 6981880 | Non-oriented wire in elastomer electrical contact | William L. Brodsky, William E. Buchler, Jr., Benson Chan | 2006-01-03 |
| 6974915 | Printed wiring board interposer sub-assembly and method | William L. Brodsky, Benson Chan, Voya R. Markovich | 2005-12-13 |
| 6949415 | Module with adhesively attached heat sink | David J. Alcoe, Thomas W. Dalrymple, Randall J. Stutzman | 2005-09-27 |
| 6893591 | Thermoplastic adhesive preform for heat sink attachment | John G. Davis, Joseph D. Poole | 2005-05-17 |
| 6892451 | Method of making an interposer sub-assembly in a printed wiring board | William L. Brodsky, Benson Chan, Voya R. Markovich | 2005-05-17 |
| 6893523 | Method for bonding heat sinks to overmold material | William R. Hill | 2005-05-17 |
| 6835441 | Bonding together surfaces | Ramesh R. Kodnani | 2004-12-28 |
| 6803256 | Cap attach surface modification for improved adhesion | Stephen L. Buchwalter, Hung Manh Dang, Konstantinos I. Papathomas | 2004-10-12 |
| 6777817 | Reworkable and thermally conductive adhesive and use thereof | Stephen L. Buchwalter, Nancy C. LaBianca, Stefano S. Oggioni, Son K. Tran | 2004-08-17 |
| 6770968 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2004-08-03 |
| 6744132 | Module with adhesively attached heat sink | David J. Alcoe, Thomas W. Dalrymple, Randall J. Stutzman | 2004-06-01 |
| 6739046 | Method for producing dendrite interconnect for planarization | Bernd Karl Appelt, Saswati Datta, John M. Lauffer, James R. Wilcox | 2004-05-25 |
| 6740959 | EMI shielding for semiconductor chip carriers | David J. Alcoe, Jeffrey T. Coffin, Harvey C. Hamel, Mario J. Interrante, Brenda Peterson +6 more | 2004-05-25 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2004-04-13 |
| 6695623 | Enhanced electrical/mechanical connection for electronic devices | William L. Brodsky, David V. Caletka, Voya R. Markovich | 2004-02-24 |
| 6670223 | Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses | Eric A. Johnson | 2003-12-30 |
| 6661661 | Common heatsink for multiple chips and modules | Howard Victor Mahaney, Jr., Mark V. Pierson | 2003-12-09 |