Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251160 | Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Stefano S. Oggioni, Thomas J. Brunschwiler | 2022-02-15 |
| 10886254 | Flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Stefano S. Oggioni, Thomas J. Brunschwiler | 2021-01-05 |
| 10767939 | Disconnect assembly for active cooling of packaged electronics | Stephan Paredes, Ingmar G. Meijer, Thomas J. Brunschwiler | 2020-09-08 |
| 10763189 | Sealing arrangement | Ingmar G. Meijer, Stefano S. Oggioni, Stephan Paredes | 2020-09-01 |
| 10727158 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more | 2020-07-28 |
| 10727159 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more | 2020-07-28 |
| 10551132 | Heat removal element with thermal expansion coefficient mismatch | Gerhard Ingmar Meijer | 2020-02-04 |
| 10529648 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more | 2020-01-07 |
| 10527365 | Disconnect assembly for active cooling of packaged electronics | Stephan Paredes, Ingmar G. Meijer, Thomas J. Brunschwiler | 2020-01-07 |
| 10388540 | High-performance compliant heat-exchanger comprising vapor chamber | Thomas J. Brunschwiler, Ingmar G. Meijer, Stephan Paredes | 2019-08-20 |
| 10157814 | Compliant heat sink | Gerhard Ingmar Meijer | 2018-12-18 |
| 10153250 | Flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Stefano S. Oggioni, Thomas J. Brunschwiler | 2018-12-11 |
| 10132433 | Releasable, threadless conduit connector for liquid manifold | Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr. | 2018-11-20 |
| 10107426 | Releasable, threadless conduit connector for liquid manifold | Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr. | 2018-10-23 |
| 10006571 | Releasable, threadless conduit connector for liquid manifold | Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr. | 2018-06-26 |
| 9941189 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more | 2018-04-10 |
| 9880595 | Cooling device with nested chambers for computer hardware | Thomas J. Brunschwiler, Ingmar G. Meijer, Bruno Michel, Stephan Paredes | 2018-01-30 |
| 9864152 | Optical assembly with optical coupler | Antonio La Porta | 2018-01-09 |
| 9698089 | Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section | Thomas J. Brunschwiler, Dominic Gschwend, Keiji Matsumoto, Stefano S. Oggioni, Timo J. Tick +1 more | 2017-07-04 |
| 9433077 | Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section | Thomas J. Brunschwiler, Dominic Gschwend, Keiji Matsumoto, Stefano S. Oggioni, Timo J. Tick +1 more | 2016-08-30 |
| 9397042 | Integrated helical multi-layer inductor structures | Thomas J. Brunschwiler, Michele Castriotta, Rachel Gordin, Stefano S. Oggioni | 2016-07-19 |
| 9230832 | Method for manufacturing a filled cavity between a first and a second surface | Thomas J. Brunschwiler, Stephan Paredes, Heiko Wolf | 2016-01-05 |
| 9066460 | Disassemblable electronic assembly with leak-inhibiting coolant capillaries | Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Werner Escher, Ingmar G. Meijer +2 more | 2015-06-23 |
| 8937810 | Electronic assembly with detachable coolant manifold and coolant-cooled electronic module | Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Werner Escher, Ingmar G. Meijer +3 more | 2015-01-20 |
| 8907503 | Manufacturing an underfill in a semiconductor chip package | Thomas J. Brunschwiler, Javier V. Goicochea, Stefano S. Oggioni | 2014-12-09 |