| 11251160 |
Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask |
Stefano S. Oggioni, Thomas J. Brunschwiler |
2022-02-15 |
| 10886254 |
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask |
Stefano S. Oggioni, Thomas J. Brunschwiler |
2021-01-05 |
| 10767939 |
Disconnect assembly for active cooling of packaged electronics |
Stephan Paredes, Ingmar G. Meijer, Thomas J. Brunschwiler |
2020-09-08 |
| 10763189 |
Sealing arrangement |
Ingmar G. Meijer, Stefano S. Oggioni, Stephan Paredes |
2020-09-01 |
| 10727158 |
Counter-flow expanding channels for enhanced two-phase heat removal |
Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more |
2020-07-28 |
| 10727159 |
Counter-flow expanding channels for enhanced two-phase heat removal |
Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more |
2020-07-28 |
| 10551132 |
Heat removal element with thermal expansion coefficient mismatch |
Gerhard Ingmar Meijer |
2020-02-04 |
| 10529648 |
Counter-flow expanding channels for enhanced two-phase heat removal |
Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more |
2020-01-07 |
| 10527365 |
Disconnect assembly for active cooling of packaged electronics |
Stephan Paredes, Ingmar G. Meijer, Thomas J. Brunschwiler |
2020-01-07 |
| 10388540 |
High-performance compliant heat-exchanger comprising vapor chamber |
Thomas J. Brunschwiler, Ingmar G. Meijer, Stephan Paredes |
2019-08-20 |
| 10157814 |
Compliant heat sink |
Gerhard Ingmar Meijer |
2018-12-18 |
| 10153250 |
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask |
Stefano S. Oggioni, Thomas J. Brunschwiler |
2018-12-11 |
| 10132433 |
Releasable, threadless conduit connector for liquid manifold |
Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr. |
2018-11-20 |
| 10107426 |
Releasable, threadless conduit connector for liquid manifold |
Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr. |
2018-10-23 |
| 10006571 |
Releasable, threadless conduit connector for liquid manifold |
Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr. |
2018-06-26 |
| 9941189 |
Counter-flow expanding channels for enhanced two-phase heat removal |
Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more |
2018-04-10 |
| 9880595 |
Cooling device with nested chambers for computer hardware |
Thomas J. Brunschwiler, Ingmar G. Meijer, Bruno Michel, Stephan Paredes |
2018-01-30 |
| 9864152 |
Optical assembly with optical coupler |
Antonio La Porta |
2018-01-09 |
| 9698089 |
Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section |
Thomas J. Brunschwiler, Dominic Gschwend, Keiji Matsumoto, Stefano S. Oggioni, Timo J. Tick +1 more |
2017-07-04 |
| 9433077 |
Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section |
Thomas J. Brunschwiler, Dominic Gschwend, Keiji Matsumoto, Stefano S. Oggioni, Timo J. Tick +1 more |
2016-08-30 |
| 9397042 |
Integrated helical multi-layer inductor structures |
Thomas J. Brunschwiler, Michele Castriotta, Rachel Gordin, Stefano S. Oggioni |
2016-07-19 |
| 9230832 |
Method for manufacturing a filled cavity between a first and a second surface |
Thomas J. Brunschwiler, Stephan Paredes, Heiko Wolf |
2016-01-05 |
| 9066460 |
Disassemblable electronic assembly with leak-inhibiting coolant capillaries |
Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Werner Escher, Ingmar G. Meijer +2 more |
2015-06-23 |
| 8937810 |
Electronic assembly with detachable coolant manifold and coolant-cooled electronic module |
Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Werner Escher, Ingmar G. Meijer +3 more |
2015-01-20 |
| 8907503 |
Manufacturing an underfill in a semiconductor chip package |
Thomas J. Brunschwiler, Javier V. Goicochea, Stefano S. Oggioni |
2014-12-09 |
