Issued Patents All Time
Showing 51–75 of 128 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9684862 | Microelectronic smart tags | Monty M. Denneau, John U. Knickerbocker, Robert L. Wisnieff | 2017-06-20 |
| 9660525 | Three-D power converter in three distinct strata | Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff | 2017-05-23 |
| 9620824 | Micro battery design and diagnosis | Qiang Huang, Yu Luo, Adinath S. Narasgond | 2017-04-11 |
| 9601364 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2017-03-21 |
| 9520779 | Three-D power converter in three distinct strata | Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff | 2016-12-13 |
| 9508566 | Wafer level overmold for three dimensional surfaces | Bing Dang, Eric P. Lewandowski, Jae-Woong Nah, Bucknell C. Webb | 2016-11-29 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker, Eric P. Lewandowski +2 more | 2016-10-18 |
| 9418895 | Dies for RFID devices and sensor applications | Robert L. Wisnieff | 2016-08-16 |
| 9412663 | Dies for RFID devices and sensor applications | Robert L. Wisnieff | 2016-08-09 |
| 9362223 | Integrated circuit assembly with cushion polymer layer | Sarah H. Knickerbocker, Ron R. Legario, Cornelia K. Tsang, Melvin P. Zussman | 2016-06-07 |
| 9331141 | CMOS structure on replacement substrate | Edmund J. Sprogis, Cornelia K. Tsang | 2016-05-03 |
| 9324601 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2016-04-26 |
| 9312761 | Three-D power converter in three distinct strata | Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff | 2016-04-12 |
| 9299665 | Formation of alpha particle shields in chip packaging | Cyril Cabral, Jr., Kenneth P. Rodbell, Robert L. Wisnieff | 2016-03-29 |
| 9209128 | Integrated circuit assembly with cushion polymer layer | Sarah H. Knickerbocker, Ron R. Legario, Cornelia K. Tsang, Melvin P. Zussman | 2015-12-08 |
| 9200883 | Transferable probe tips | Bing Dang, Steven L. Wright | 2015-12-01 |
| 9159602 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | John M. Cotte, John U. Knickerbocker, Cornelia K. Tsang | 2015-10-13 |
| 9059161 | Composite wiring board with electrical through connections | Evan G. Colgan, Robert L. Wisnieff | 2015-06-16 |
| 9029238 | Advanced handler wafer bonding and debonding | Russell A. Budd, John U. Knickerbocker, Robert E. Trzcinski, Douglas C. La Tulipe, Jr. | 2015-05-12 |
| 8928145 | Formation of alpha particle shields in chip packaging | Cyril Cabral, Jr., Kenneth P. Rodbell, Robert L. Wisnieff | 2015-01-06 |
| 8855452 | Silicon photonic chip optical coupling structures | Russell A. Budd, Frank R. Libsch, Robert L. Wisnieff | 2014-10-07 |
| 8735251 | Through silicon via and method of fabricating same | Edmund J. Sprogis, Cornelia K. Tsang | 2014-05-27 |
| 8658535 | Optimized annular copper TSV | Mukta G. Rarooq, Robert Hannon, Subramanian S. Iyer, Emily R. Kinser, Comelia K. Tsang +1 more | 2014-02-25 |
| 8637937 | Through silicon via for use in integrated circuit chips | Edmund J. Sprogis, Cornelia K. Tsang | 2014-01-28 |
| 8592932 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | John M. Cotte, John U. Knickerbocker, Cornelia K. Tsang | 2013-11-26 |