Issued Patents All Time
Showing 76–100 of 128 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8564113 | Electrostatic chucking of an insulator handle substrate | Edward C. Cooney, III, Edmund J. Sprogis, Anthony K. Stamper, Cornelia K. Tsang | 2013-10-22 |
| 8559474 | Silicon carrier optoelectronic packaging | Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano, Paul F. Fortier +4 more | 2013-10-15 |
| 8487425 | Optimized annular copper TSV | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Emily R. Kinser, Cornelia K. Tsang +1 more | 2013-07-16 |
| 8440544 | CMOS structure and method of manufacture | Edmund J. Sprogis, Cornelia K. Tsang | 2013-05-14 |
| 8388782 | Handler attachment for integrated circuit fabrication | Bing Dang, John U. Knickerbocker, Aparna Prahbakar, Peter J. Sorce, Robert E. Trzcinski +1 more | 2013-03-05 |
| 8354737 | Small area, robust silicon via structure and process | John M. Cotte, John U. Knickerbocker, Cornelia K. Tsang | 2013-01-15 |
| 8298917 | Process for wet singulation using a dicing singulation structure | Timothy H. Daubenspeck, Jeffrey P. Gambino, Edmund J. Sprogis, Cornelia K. Tsang | 2012-10-30 |
| 8295056 | Silicon carrier structure and method of forming same | Harm Peter Hofstee, George A. Katopis, John U. Knickerbocker, Robert K. Montoye, Chirag S. Patel | 2012-10-23 |
| 8290008 | Silicon carrier optoelectronic packaging | Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano, Paul F. Fortier +4 more | 2012-10-16 |
| 8263497 | High-yield method of exposing and contacting through-silicon vias | John M. Cotte, Michael F. Lofaro, Edmund J. Sprogis, James A. Tornello, Cornelia K. Tsang | 2012-09-11 |
| 8247271 | Formation of alpha particle shields in chip packaging | Cyril Cabral, Jr., Kenneth P. Rodbell, Robert L. Wisnieff | 2012-08-21 |
| 8242591 | Electrostatic chucking of an insulator handle substrate | Edward C. Cooney, III, Edmund J. Sprogis, Anthony K. Stamper, Cornelia K. Tsang | 2012-08-14 |
| 8227264 | Reworkable electronic device assembly and method | Stephen L. Buchwalter, George A. Katopis, John U. Knickerbocker, Stelios G. Tsapepas, Bucknell C. Webb | 2012-07-24 |
| 8198734 | Silicon-on-insulator structures for through via in silicon carriers | Brent A. Anderson, Edmund J. Sprogis, Cornelia K. Tsang | 2012-06-12 |
| 8187923 | Laser release process for very thin Si-carrier build | Leena Paivikki Buchwalter, Matthew J. Farinelli, Sherif A. Goma, Raymond R. Horton, Edmund J. Sprogis | 2012-05-29 |
| 8173541 | Chip carrier substrate including capacitor and method for fabrication thereof | Chirag S. Patel | 2012-05-08 |
| 8138036 | Through silicon via and method of fabricating same | Edmund J. Sprogis, Cornelia K. Tsang | 2012-03-20 |
| 8115302 | Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling device | Evan G. Colgan | 2012-02-14 |
| 8080876 | Structure and method for creating reliable deep via connections in a silicon carrier | John U. Knickerbocker, Michelle L. Steen, Cornelia K. Tsang | 2011-12-20 |
| 8012796 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | John M. Cotte, John U. Knickerbocker, Cornelia K. Tsang | 2011-09-06 |
| 7990711 | Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate | Thomas J. Brunschwiler, Evan G. Colgan, John Harold Magerlein | 2011-08-02 |
| 7948077 | Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement | Evan G. Colgan, Lawrence S. Mok, Chirag S. Patel, David E. Seeger | 2011-05-24 |
| 7936060 | Reworkable electronic device assembly and method | Stephen L. Buchwalter, George A. Katopis, John U. Knickerbocker, Stelios G. Tsapepas, Bucknell C. Webb | 2011-05-03 |
| 7902069 | Small area, robust silicon via structure and process | John M. Cotte, John U. Knickerbocker, Cornelia K. Tsang | 2011-03-08 |
| 7888786 | Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device | Evan G. Colgan, Lawrence S. Mok, Chirag S. Patel, David E. Seeger | 2011-02-15 |