Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5531022 | Method of forming a three dimensional high performance interconnection package | Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Paul A. Lauro, Maurice Heathcote Norcott +4 more | 1996-07-02 |