MN

Maurice Heathcote Norcott

IBM: 27 patents #3,831 of 70,183Top 6%
📍 Valley Cottage, NY: #4 of 87 inventorsTop 5%
🗺 New York: #4,646 of 115,490 inventorsTop 5%
Overall (All Time): #147,696 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 1–25 of 27 patents

Patent #TitleCo-InventorsDate
7538565 High density integrated circuit apparatus, test probe and methods of use thereof Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih, George F. Walker 2009-05-26
7492008 Control of buried oxide in SIMOX Stephen Fox, Neena Garg, Kenneth J. Giewont, Junedong Lee, Siegfried Maurer +2 more 2009-02-17
7332922 Method for fabricating a structure for making contact with a device Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih 2008-02-19
7276919 High density integral test probe Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih, George F. Walker 2007-10-02
6880245 Method for fabricating a structure for making contact with an IC device Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih 2005-04-19
6784072 Control of buried oxide in SIMOX Stephen Fox, Neena Garg, Kenneth J. Giewont, Junedong Lee, Siegfried Maurer +2 more 2004-08-31
6756639 Control of buried oxide quality in low dose SIMOX Devendra K. Sadana 2004-06-29
6722032 Method of forming a structure for electronic devices contact locations Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih 2004-04-20
6717217 Ultimate SIMOX Keith E. Fogel, Devendra K. Sadana 2004-04-06
6541356 Ultimate SIMOX Keith E. Fogel, Devendra K. Sadana 2003-04-01
6486037 Control of buried oxide quality in low dose SIMOX Devendra K. Sadana 2002-11-26
6334247 High density integrated circuit apparatus, test probe and methods of use thereof Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih, George F. Walker 2002-01-01
6332270 Method of making high density integral test probe Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih, George F. Walker 2001-12-25
6329827 High density cantilevered probe for electronic devices Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih 2001-12-11
6300780 High density integrated circuit apparatus, test probe and methods of use thereof Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih, George F. Walker 2001-10-09
6286208 Interconnector with contact pads having enhanced durability Da-Yuan Shih, Paul A. Lauro, Keith E. Fogel, Brian S. Beaman 2001-09-11
6104201 Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih, George F. Walker 2000-08-15
6062879 High density test probe with rigid surface structure Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih 2000-05-16
5914614 High density cantilevered probe for electronic devices Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih 1999-06-22
5838160 Integral rigid chip test probe Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih, George F. Walker 1998-11-17
5821763 Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih, George F. Walker 1998-10-13
5811982 High density cantilevered probe for electronic devices Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yaun Shih 1998-09-22
5810607 Interconnector with contact pads having enhanced durability Da-Yuan Shih, Paul A. Lauro, Keith E. Fogel, Brian S. Beaman 1998-09-22
5785538 High density test probe with rigid surface structure Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih 1998-07-28
5635846 Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih, George F. Walker 1997-06-03