Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5531022 | Method of forming a three dimensional high performance interconnection package | Brain S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Paul A. Lauro +4 more | 1996-07-02 |
| 5371654 | Three dimensional high performance interconnection package | Brian S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Paul A. Lauro +4 more | 1994-12-06 |