ES

Edmund M. Sikorski

IBM: 6 patents #16,453 of 70,183Top 25%
ZE Zeon: 3 patents #220 of 734Top 30%
📍 Florida, NY: #5 of 29 inventorsTop 20%
🗺 New York: #23,203 of 115,490 inventorsTop 25%
Overall (All Time): #845,290 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
9711365 Etch rate enhancement for a silicon etch process through etch chamber pretreatment Eric A. Joseph, Goh Matsuura, Masahiro Nakamura, Bang N. To 2017-07-18
8928124 High aspect ratio and reduced undercut trench etch process for a semiconductor substrate Nicholas C. M. Fuller, Eric A. Joseph, Goh Matsuura 2015-01-06
8652969 High aspect ratio and reduced undercut trench etch process for a semiconductor substrate Nicholas C. M. Fuller, Eric A. Joseph, Goh Matsuura 2014-02-18
7820552 Advanced high-k gate stack patterning and structure containing a patterned high-k gate stack Siva Kanakasabapathy, Ying Zhang, Hongwen Yan, Vijay Narayanan, Vamsi K. Paruchuri +1 more 2010-10-26
6743686 Sacrificial polysilicon sidewall process and rapid thermal spike annealing for advance CMOS fabrication Kam-Leung Lee, Ying Zhang, Maheswaran Surendra 2004-06-01
6518136 Sacrificial polysilicon sidewall process and rapid thermal spike annealing for advance CMOS fabrication Kam-Leung Lee, Ying Zhang, Maheswaran Surendra 2003-02-11