Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thin film interconnects with large grains

Thin film interconnects with large grains

US Patent 10727121 · Granted Jul 28, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microfluidic chips with one or more vias filled with sacrificial plugs2025
Suppression of void-formation of PCM materials2025
In-situ low temperature dielectric deposition and selective trim of phase change2025
System, method and apparatus for sensor insertion2025
Redundant bottom pad and sacrificial via contact for process induced RRAM formin2025
Process-induced forming of oxide RRAM2025
Self-forming embedded diffusion barriers2025
Phase-change memory cell with mixed-material switchable region2025
Method for producing flexible tooling for casting a ceramic core2025
Applying inert ion beam etching for improving a profile and repairing sidewall d2025
Method and apparatus for insertion of a sensor2025
Stacked access device and resistive memory2025