Issued Patents All Time
Showing 26–50 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653395 | Hybrid subtractive etch/metal fill process for fabricating interconnects | Robert L. Bruce, Gregory M. Fritz, Hiroyuki Miyazoe | 2017-05-16 |
| 9646881 | Hybrid subtractive etch/metal fill process for fabricating interconnects | Robert L. Bruce, Gregory M. Fritz, Hiroyuki Miyazoe | 2017-05-09 |
| 9583401 | Nano deposition and ablation for the repair and fabrication of integrated circuits | Shawn A. Adderly, Jeffrey P. Gambino, Anthony C. Speranza | 2017-02-28 |
| 9564362 | Interconnects based on subtractive etching of silver | Brett C. Baker-O'Neal, Hiroyuki Miyazoe | 2017-02-07 |
| 9536731 | Wet clean process for removing CxHyFz etch residue | Robert L. Bruce, Sebastian U. Engelmann, Mahmoud Khojasteh, Masahiro Nakamura, Satyavolu S. Papa Rao +3 more | 2017-01-03 |
| 9493879 | Selective sputtering for pattern transfer | Mark Hoinkis, Hiroyuki Miyazoe | 2016-11-15 |
| 9484220 | Sputter etch processing for heavy metal patterning in integrated circuits | Mark Hoinkis, Hiroyuki Miyazoe, Chun Yan | 2016-11-01 |
| 9472499 | Self-aligned pitch split for unidirectional metal wiring | Josephine B. Chang, Michael A. Guillorn, Hiroyuki Miyazoe | 2016-10-18 |
| 9299638 | Patterning transition metals in integrated circuits | Cyril Cabral, Jr., Sebastian U. Engelmann, Benjamin L. Fletcher, Michael S. Gordon | 2016-03-29 |
| 9299639 | Patterning transition metals in integrated circuits | Cyril Cabral, Jr., Sebastian U. Engelmann, Benjamin L. Fletcher, Michael S. Gordon | 2016-03-29 |
| 9263393 | Sputter and surface modification etch processing for metal patterning in integrated circuits | Cyril Cabral, Jr., Benjamin L. Fletcher, Nicholas C. M. Fuller, Hiroyuki Miyazoe | 2016-02-16 |
| 9171796 | Sidewall image transfer for heavy metal patterning in integrated circuits | Markus Brink, Michael A. Guillorn, Mark Hoinkis, Hiroyuki Miyazoe, Bang N. To | 2015-10-27 |
| 9166165 | Uniform critical dimension size pore for PCRAM application | Matthew J. Breitwisch, Roger W. Cheek, Chung H. Lam, Hsiang-Lan Lung, Alejandro G. Schrott | 2015-10-20 |
| 9114438 | Copper residue chamber clean | Mark Hoinkis, Chun Yan, Hiroyuki Miyazoe | 2015-08-25 |
| 9105583 | Catalytic etch with magnetic direction control | David W. Abraham, Roger W. Cheek, Alejandro G. Schrott, Ying Zhang | 2015-08-11 |
| 9064727 | Sputter and surface modification etch processing for metal patterning in integrated circuits | Cyril Cabral, Jr., Benjamin L. Fletcher, Nicholas C. M. Fuller, Hiroyuki Miyazoe | 2015-06-23 |
| 9018090 | Borderless self-aligned metal contact patterning using printable dielectric materials | Josephine B. Chang, Sebastian U. Engelmann, Nicholas C. M. Fuller, Michael A. Guillorn, Adam M. Pyzyna | 2015-04-28 |
| 9013010 | Nanopore sensor device | Josephine B. Chang, Michael A. Guillorn, Satyavolu S. Papa Rao | 2015-04-21 |
| 8993907 | Silicide micromechanical device and methods to fabricate same | Michael A. Guillorn, Fei Liu, Zhen Zhang | 2015-03-31 |
| 8987031 | Fabricating a small-scale radiation detector | Michael S. Gordon, Christopher V. Jahnes, Hiroyuki Miyazoe, Kenneth P. Rodbell, Arun Sharma +1 more | 2015-03-24 |
| 8928124 | High aspect ratio and reduced undercut trench etch process for a semiconductor substrate | Nicholas C. M. Fuller, Edmund M. Sikorski, Goh Matsuura | 2015-01-06 |
| 8900975 | Nanopore sensor device | Josephine B. Chang, Michael A. Guillorn, Satyavolu S. Papa Rao | 2014-12-02 |
| 8884387 | Pillar-based interconnects for magnetoresistive random access memory | Solomon Assefa, Michael C. Gaidis, Eugene J. O'Sullivan | 2014-11-11 |
| 8871107 | Subtractive plasma etching of a blanket layer of metal or metal alloy | Nicholas C. M. Fuller, Hiroyuki Miyazoe, Mark Hoinkis, Chun Yan | 2014-10-28 |
| 8809828 | Small footprint phase change memory cell | Matthew J. Breitwisch, Chung H. Lam, Hsiang-Lan Lung | 2014-08-19 |