Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9535042 | Method and system for monitoring biomolecule separations by mass spectrometry | Alexander Iain McIntosh | 2017-01-03 |
| 9391040 | Planarity-tolerant reworkable interconnect with integrated testing | Bing Dang, John U. Knickerbocker, Yang Liu, Yu Luo | 2016-07-12 |
| 9200883 | Transferable probe tips | Paul S. Andry, Bing Dang | 2015-12-01 |
| 8965060 | Automatic detection of object pixels for hyperspectral analysis | James Janni | 2015-02-24 |
| 8796616 | Miniature mass spectrometer system | Christopher Wright | 2014-08-05 |
| 8674506 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2014-03-18 |
| 8653450 | Microengineered multipole ion guide | Shane Martin O'Prey | 2014-02-18 |
| 8582648 | System and method for selective image capture, transmission and reconstruction | Steven T. Berman, Paul F. Greier, Kenneth C. Ho, Richard I. Kaufman, Alphonso P. Lanzetta +4 more | 2013-11-12 |
| 8558167 | Microengineered multipole rod assembly | — | 2013-10-15 |
| 8507847 | Microengineered multipole ion guide | Shane Martin O'Prey | 2013-08-13 |
| 8446006 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2013-05-21 |
| 8298929 | Offset solder vias, methods of manufacturing and design structures | Timothy H. Daubenspeck, Gary LaFontant, Ekta Misra, David L. Questad, George J. Scott +3 more | 2012-10-30 |
| 8264078 | Metal wiring structures for uniform current density in C4 balls | Timothy H. Daubenspeck, Wolfgang Sauter, Timothy D. Sullivan, Edmund J. Sprogis | 2012-09-11 |
| 8127595 | Pre-concentrator and sample interface | Alan Patrick John Finlay, Eric Yeatman | 2012-03-06 |
| 8084858 | Metal wiring structures for uniform current density in C4 balls | Timothy H. Daubenspeck, Wolfgang Sauter, Timothy D. Sullivan, Edmund J. Sprogis | 2011-12-27 |
| 7615405 | Method for precision assembly of integrated circuit chip packages | Paul S. Andry, Leena Paivikki Buchwalter, Raymond R. Horton, John U. Knickerbocker, Cornelia K. Tsang | 2009-11-10 |
| 7609144 | High resistivity thin film composition and fabrication method | Michael G. Lee, Philip Judge, Craig Wilson, Gregory Cestra, Derek F. Bowers | 2009-10-27 |
| 7508517 | Non-destructive single seed or several seeds NIR analyzer and method | — | 2009-03-24 |
| 7501708 | Microelectronic device connection structure | Paul S. Andry | 2009-03-10 |
| 7492821 | System and method for selective image capture, transmission and reconstruction | Steven T. Berman, Paul F. Greier, Kenneth C. Ho, Richard I. Kaufman, Alphonso P. Lanzetta +4 more | 2009-02-17 |
| 7474540 | Silicon carrier including an integrated heater for die rework and wafer probe | Bing Dang | 2009-01-06 |
| 7435952 | Integrated analytical device | Alan Patrick John Finlay, Eric Yeatman | 2008-10-14 |
| 7282391 | Method for precision assembly of integrated circuit chip packages | Paul S. Andry, Leena Paivikki Buchwalter, Raymond R. Horton, John U. Knickerbocker, Cornelia K. Tsang | 2007-10-16 |
| 7274456 | Non-destructive single seed or several seeds NIR analyzer and method | — | 2007-09-25 |
| 6870643 | Method and system for error diffusion with a plurality of error measures | Gerhard Robert Thompson, Chai Wah Wu | 2005-03-22 |