Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device layer thin-film transfer to thermally conductive substrate

Device layer thin-film transfer to thermally conductive substrate

US Patent 10396220 · Granted Aug 27, 2019

Estimated economic value: $1,335,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Enclosed, multi-chamber metering and mixing system used for urinalysis2025
Infrared debond damage mitigation by copper fill pattern2025
Electronic package with varying interconnects2024
Electronic substrate stacking2024
Embedded oral sensor platform2024
Interconnection structures for high bandwidth data transfer2024
Multi-sensor platform for health monitoring2024
Multi-sensor platform for health monitoring2024
High density interconnection and wiring layers, package structures, and integrat2024
Multiple die assembly2024
Wearable multiplatform sensor2024
Silicon handler with laser-release layers2024