Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9738560 | Controlling fragmentation of chemically strengthened glass | Cyril Cabral, Jr., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang +3 more | 2017-08-22 |
| 9586857 | Controlling fragmentation of chemically strengthened glass | Cyril Cabral, Jr., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang +3 more | 2017-03-07 |
| 9586291 | Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release | Bing Dang, John U. Knickerbocker, Cornelia K. Tsang | 2017-03-07 |
| 9508566 | Wafer level overmold for three dimensional surfaces | Paul S. Andry, Bing Dang, Jae-Woong Nah, Bucknell C. Webb | 2016-11-29 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker +2 more | 2016-10-18 |
| 9321245 | Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion | Michael A. Gaynes, Jae-Woong Nah, Robert J. Polastre | 2016-04-26 |
| 9181440 | Low alpha particle emission electrically-conductive coating | Michael A. Gaynes, Michael S. Gordon | 2015-11-10 |
| 8987130 | Reactive bonding of a flip chip package | Gregory M. Fritz | 2015-03-24 |
| 8815725 | Low alpha particle emission electrically-conductive coating | Michael A. Gaynes, Michael S. Gordon | 2014-08-26 |