Issued Patents All Time
Showing 51–75 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7703661 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, Brian R. Sundlof, S. Jay Chey +4 more | 2010-04-27 |
| 7665999 | Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-02-23 |
| 7658616 | Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-02-09 |
| 7648369 | Interposer with electrical contact button and method | Keith E. Fogel, Joanna Rosner, Paul A. Lauro, Sherif A. Goma, Joseph Zinter | 2010-01-19 |
| 7641479 | Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-01-05 |
| 7613368 | Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types | Russell A. Budd, Punit P. Chiniwalla, Paul W. Coteus, Alphonso P. Lanzetta, Frank R. Libsch | 2009-11-03 |
| 7579069 | Negative coefficient of thermal expansion particles and method of forming the same | Xiao Hu Liu, S. Jay Chey, James P. Doyle, Joseph Zinter, Michael J. Rooks +2 more | 2009-08-25 |
| 7566959 | Planar array contact memory cards | Paul W. Coteus, Kevin C. Gower, Shawn A. Hall, Dale J. Pearson | 2009-07-28 |
| 7556979 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more | 2009-07-07 |
| 7491068 | Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2009-02-17 |
| 7491067 | Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2009-02-17 |
| 7488182 | Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2009-02-10 |
| 7484966 | Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2009-02-03 |
| 7479014 | Land grid array fabrication using elastomer core and conducting metal shell or mesh | Keith E. Fogel, Paul A. Lauro, Joseph Zinter | 2009-01-20 |
| 7473102 | Space transforming land grid array interposers | Evan G. Colgan, Paul W. Coteus, Hubert Harrer, John Harold Magerlein, John G. Torok | 2009-01-06 |
| 7467951 | Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometries | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2008-12-23 |
| 7462039 | LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2008-12-09 |
| 7458817 | Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2008-12-02 |
| 7452568 | Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation | Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon A. Casey, Claudius Feger, Matteo Flotta +5 more | 2008-11-18 |
| 7452212 | Metalized elastomeric electrical contacts | Ali Afzali, Steven A. Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma +4 more | 2008-11-18 |
| 7442049 | Electrical connecting device and method of forming same | Brian S. Beaman, Claudius Feger | 2008-10-28 |
| 7417315 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more | 2008-08-26 |
| 7402053 | Pin grid array zero insertion force connectors configurable for supporting large pin counts | William L. Brodsky, Thomas M. Cipolla, Paul W. Coteus, Ronald Malfatt | 2008-07-22 |
| 7402052 | Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2008-07-22 |
| 7381063 | Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2008-06-03 |