Issued Patents All Time
Showing 26–50 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8171630 | Method of producing a land grid array interposer | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2012-05-08 |
| 8138592 | Planar array contact memory cards | Paul W. Coteus, Kevin C. Gower, Shawn A. Hall, Dale J. Pearson | 2012-03-20 |
| 8138448 | Negative coefficient thermal expansion engineered particles for composite fabrication | Vijayeshwar D. Khanna, Xiao Hu Liu, Gerard McVicker | 2012-03-20 |
| 8136242 | Method of producing a land grid array interposer utilizing metal-on-elastomer | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2012-03-20 |
| 8119206 | Negative coefficient of thermal expansion particles | Xiao Hu Liu, S. Jay Chey, Joseph Zinter, Michael J. Rooks, Brian Richard Sundolf +1 more | 2012-02-21 |
| 8054095 | Metalized elastomeric probe structure | Ali Afzali, Steven A. Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma +4 more | 2011-11-08 |
| 8037600 | Method of producing a land grid array interposer structure | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2011-10-18 |
| 8011563 | Compliant mold fill head with integrated cavity venting and solder cooling | Russell A. Budd, Evan G. Colgan, Peter A. Gruber, John P. Karidis | 2011-09-06 |
| 7975379 | Method of making a land-grid-array (LGA) interposer | Brian S. Beaman, John Saunders Corbin, Jr., Paul W. Coteus, Shawn A. Hall, Kathleen C. Hinge +3 more | 2011-07-12 |
| 7897878 | Compliant penetrating packaging interconnect | Paul W. Coteus, Brian R. Sundlof | 2011-03-01 |
| 7883919 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging | S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more | 2011-02-08 |
| 7863089 | Planar array contact memory cards | Paul W. Coteus, Kevin C. Gower, Shawn A. Hall, Dale J. Pearson | 2011-01-04 |
| 7863091 | Planar array contact memory cards | Paul W. Coteus, Kevin C. Gower, Shawn A. Hall, Dale J. Pearson | 2011-01-04 |
| 7836585 | Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-11-23 |
| 7832095 | Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-11-16 |
| 7832094 | Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-11-16 |
| 7823278 | Method for fabricating electrical contact buttons | Keith E. Fogel, Joanna Rosner, Paul A. Lauro, Sherif A. Goma, Joseph Zinter | 2010-11-02 |
| 7823283 | Method of forming a land grid array interposer | Brian S. Beaman, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-11-02 |
| 7820488 | Microelectronic devices and methods | Sri M. Sri-Jayantha, Sung Kwon Kang, Lawrence S. Mok, Hien Dang, Arun Sharma | 2010-10-26 |
| 7815968 | Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation | Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon A. Casey, Claudius Feger, Matteo Flotta +5 more | 2010-10-19 |
| 7784669 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, Brian R. Sundlof, S. Jay Chey +4 more | 2010-08-31 |
| 7776993 | Underfilling with acid-cleavable acetal and ketal epoxy oligomers | Stephen L. Buchwalter, Claudius Feger, Nancy C. LaBianca, Hosadurga Shobha | 2010-08-17 |
| 7771208 | Metalized elastomeric electrical contacts | Ali Afzali, Steven A. Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma +4 more | 2010-08-10 |
| 7736152 | Land grid array fabrication using elastomer core and conducting metal shell or mesh | Keith E. Fogel, Paul A. Lauro, Joseph Zinter | 2010-06-15 |
| 7708909 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Paul A. Lauro, Brian R. Sundlof, Jeffrey D. Gelorme | 2010-05-04 |