Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6726996 | Laminated diffusion barrier | Edward Barth, Stephan A. Cohen, Chester T. Dziobkowski, John A. Fitzsimmons, Stephen M. Gates +3 more | 2004-04-27 |
| 6638878 | Film planarization for low-k polymers used in semiconductor structures | Jeffrey Hedrick, John A. Fitzsimmons, Christy S. Tyberg, Chih-Chien Liu, Shahab Siddiqui | 2003-10-28 |
| 6493078 | Method and apparatus to improve coating quality | John A. Fitzsimmons, Michael J. Schade | 2002-12-10 |
| 6238532 | Radio-frequency coil for use in an ionized physical vapor deposition apparatus | Stephen M. Rossnagel, Andrew H. Simon, Pavel Smetana | 2001-05-29 |
| 6176931 | Wafer clamp ring for use in an ionized physical vapor deposition apparatus | Stephen M. Rossnagel, Andrew H. Simon, Pavel Smetana, Edward C. Cooney, III | 2001-01-23 |
| 6159870 | Borophosphosilicate glass incorporated with fluorine for low thermal budget gap fill | Ashima B. Chakravarti, Richard A. Conti, Frank V. Liucci | 2000-12-12 |
| 6140236 | High throughput A1-Cu thin film sputtering process on small contact via for manufacturable beol wiring | Chi-Hua Yang, Hans W. Poetzlberger, Tomio Katata, Hideaki Aochi | 2000-10-31 |
| 6083823 | Metal deposition process for metal lines over topography | Parth Dave, Nancy Anne Greco, Ernest N. Levine | 2000-07-04 |
| 5872694 | Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage | Mark Hoinkis | 1999-02-16 |
| 5798301 | Method of manufacturing metal interconnect structure for an integrated circuit with improved electromigration reliability | Pei-Ing Lee, Bernd Vollmer, Bill Klaasen | 1998-08-25 |
| 5641992 | Metal interconnect structure for an integrated circuit with improved electromigration reliability | Pei-Ing Lee, Bernd Vollmer, Bill Klaasen | 1997-06-24 |