Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7459388 | Methods of forming dual-damascene interconnect structures using adhesion layers having high internal compressive stresses | Darryl D. Restaino, Johnny Widodo | 2008-12-02 |
JK
Jaehak Kim
Chartered Semiconductor Manufacturing: 1 patents #419 of 840Top 50%
Overall (All Time): #3,371,614 of 4,157,543Top 85%
1
Patents All Time