Issued Patents All Time
Showing 26–50 of 101 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105517 | Wafer to wafer alignment by LED/LSD devices | Mukta G. Farooq, Spyridon Skordas | 2015-08-11 |
| 9070625 | Selective etch chemistry for gate electrode materials | David L. Rath, Muthumanickam Sankarapandian | 2015-06-30 |
| 9059173 | Electronic fuse line with modified cap | Ronald G. Filippi, Erdem Kaltalioglu, Ping-Chuan Wang, Lijuan Zhang | 2015-06-16 |
| 9058976 | Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof | Vishal Chhabra, Laertis Economikos, James Hannah, Mahmoud Khojasteh, Jennifer V. Muncy | 2015-06-16 |
| 9060457 | Sidewalls of electroplated copper interconnects | Mukta G. Farooq, Troy L. Graves-Abe | 2015-06-16 |
| 9055703 | Sidewalls of electroplated copper interconnects | Mukta G. Farooq, Troy L. Graves-Abe | 2015-06-09 |
| 9040407 | Sidewalls of electroplated copper interconnects | Mukta G. Farooq, Troy L. Graves-Abe | 2015-05-26 |
| 9035465 | Forming semiconductor chip connections | Kangguo Cheng, Timothy J. Dalton, Mukta G. Farooq, Louis L. Hsu | 2015-05-19 |
| 8970041 | Co-axial restraint for connectors within flip-chip packages | Mukta G. Farooq | 2015-03-03 |
| 8956973 | Bottom-up plating of through-substrate vias | Mukta G. Farooq, Troy L. Graves-Abe | 2015-02-17 |
| 8916448 | Metal to metal bonding for stacked (3D) integrated circuits | Tien-Jen Cheng, Mukta G. Farooq | 2014-12-23 |
| 8889491 | Method of forming electronic fuse line with modified cap | Ronald G. Filippi, Erdem Kaltalioglu, Ping-Chuan Wang, Lijuan Zhang | 2014-11-18 |
| 8835326 | Titanium-nitride removal | Shyng-Tsong Chen, David L. Rath, Muthumanickam Sankarapandian, Oscar van der Straten | 2014-09-16 |
| 8835307 | Method and structure for reworking antireflective coating over semiconductor substrate | Hakeem B. S. Akinmade-Yusuff, Ranee W. Kwong | 2014-09-16 |
| 8802497 | Forming semiconductor chip connections | Louis L. Hsu, Kangguo Cheng, Timothy J. Dalton, Mukta G. Farooq | 2014-08-12 |
| 8796150 | Bilayer trench first hardmask structure and process for reduced defectivity | Hakeem B. S. Akinmade-Yusuff, Samuel S. Choi, Edward R. Engbrecht | 2014-08-05 |
| 8791005 | Sidewalls of electroplated copper interconnects | Mukta G. Farooq, Troy L. Graves-Abe | 2014-07-29 |
| 8763445 | Detecting leaks in a fluid cooling system by sensing for a drop of fluid pressure in the system | Thomas A. Kline, Patrick F. White | 2014-07-01 |
| 8647445 | Process for cleaning semiconductor devices and/or tooling during manufacturing thereof | Vishal Chhabra, Mahmoud Khojasteh, Jennifer V. Muncy | 2014-02-11 |
| 8618036 | Aqueous cerium-containing solution having an extended bath lifetime for removing mask material | Ali Afzali-Ardakani, Nicholas C. M. Fuller, Mahmoud Khojasteh, Jennifer V. Muncy, George G. Totir +4 more | 2013-12-31 |
| 8507325 | Co-axial restraint for connectors within flip-chip packages | Mukta G. Farooq | 2013-08-13 |
| 8343868 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, Jeffrey P. Gambino +10 more | 2013-01-01 |
| 8337627 | Cleaning exhaust screens in a manufacturing process | Richard O. Henry | 2012-12-25 |
| 8304863 | Electromigration immune through-substrate vias | Ronald G. Filippi, Kevin Kolvenbach, Ping-Chuan Wang | 2012-11-06 |
| 8294270 | Copper alloy via bottom liner | Daniel C. Edelstein, Edward C. Cooney, III, Jeffrey P. Gambino, Anthony K. Stamper | 2012-10-23 |