Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157789 | Via formation using sidewall image transfer process to define lateral dimension | Shyng-Tsong Chen, Cheng Chi, Chi-Chun Liu, Yann Mignot, Hosadurga Shobha +3 more | 2018-12-18 |
| 9490168 | Via formation using sidewall image transfer process to define lateral dimension | Shyng-Tsong Chen, Cheng Chi, Chi-Chun Liu, Yann Mignot, Hosadurga Shobha +3 more | 2016-11-08 |
| 9478663 | FinFET device including a uniform silicon alloy fin | Ajey Poovannummoottil Jacob, Jody A. Fronheiser, Yi Qi | 2016-10-25 |
| 9437475 | Method for fabricating microelectronic devices with isolation trenches partially formed under active regions | Maud Vinet, Romain Wacquez | 2016-09-06 |
| 9299775 | Methods for the production of integrated circuits comprising epitaxially grown replacement structures | Steven Bentley, Kejia Wang, Shurong Liang | 2016-03-29 |
| 9287130 | Method for single fin cuts using selective ion implants | Xiuyu Cai, Ajey Poovannummoottil Jacob, Ruilong Xie, Bruce B. Doris, Kangguo Cheng +7 more | 2016-03-15 |