Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8415248 | Self-aligned dual damascene BEOL structures with patternable low-k material and methods of forming same | Qinghuang Lin, Sampath Purushothaman, Terry A. Spooner, Shawn Walsh | 2013-04-09 |
| 8399350 | Formation of air gap with protection of metal lines | Takeshi Nogami, David V. Horak, Son V. Nguyen, Shom Ponoth, Chih-Chao Yang | 2013-03-19 |
| 8232195 | Method for fabricating back end of the line structures with liner and seed materials | Chih-Chao Yang, Shom Ponoth, Terry A. Spooner | 2012-07-31 |
| 8084862 | Interconnect structures with patternable low-k dielectrics and method of fabricating same | Qinghuang Lin | 2011-12-27 |
| 7892968 | Via gouging methods and related semiconductor structure | Steven J. Holmes, David V. Horak, Takeshi Nogami, Shom Ponoth, Chih-Chao Yang | 2011-02-22 |
| 7838428 | Method of repairing process induced dielectric damage by the use of GCIB surface treatment using gas clusters of organic molecular species | Nancy R. Klymko, Anita Madan, Sanjay C. Mehta, Steven E. Molis | 2010-11-23 |
| 7816253 | Surface treatment of inter-layer dielectric | Qinghuang Lin, Kelly Malone, Sanjay C. Mehta, Terry A. Spooner, Chih-Chao Yang | 2010-10-19 |
| 7745324 | Interconnect with recessed dielectric adjacent a noble metal cap | Chih-Chao Yang, Baozhen Li | 2010-06-29 |
| 7709344 | Integrated circuit fabrication process using gas cluster ion beam etching | John A. Fitzsimmons, Shom Ponoth, Terry A. Spooner | 2010-05-04 |
| 7670943 | Enhanced mechanical strength via contacts | Chih-Chao Yang, Griselda Bonilla, Kelly Malone | 2010-03-02 |
| 7671470 | Enhanced mechanical strength via contacts | Chih-Chao Yang, Griselda Bonilla, Kelly Malone | 2010-03-02 |
| 7666753 | Metal capping process for BEOL interconnect with air gaps | Griselda Bonilla, Matthew E. Colburn, Chih-Chao Yang | 2010-02-23 |
| 7514361 | Selective thin metal cap process | Griselda Bonilla, Matthew E. Colburn, Ronald A. DellaGuardia, Chih-Chao Yang | 2009-04-07 |
| 7479869 | Metal resistor and resistor material | Chih-Chao Yang, Kaushik Chanda | 2009-01-20 |
| 7439624 | Enhanced mechanical strength via contacts | Chih-Chao Yang, Griselda Bonilla, Kelly Malone | 2008-10-21 |
| 7402883 | Back end of the line structures with liner and noble metal layer | Chih-Chao Yang, Shom Ponoth, Terry A. Spooner | 2008-07-22 |
| 7358182 | Method of forming an interconnect structure | Heidi Baks, Timothy J. Dalton, Nicholas Fuller, Kaushik A. Kumar | 2008-04-15 |
| 7314786 | Metal resistor, resistor material and method | Chih-Chao Yang, Kaushik Chanda | 2008-01-01 |
| 7253098 | Maintaining uniform CMP hard mask thickness | Kaushik A. Kumar, Stephen E. Greco, Shom Ponoth, Terry A. Spooner, David L. Rath +1 more | 2007-08-07 |
| 7190079 | Selective capping of copper wiring | Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, Mahadevaiyer Krishnan, Wei-Tsu Tseng +1 more | 2007-03-13 |
| 7186166 | Fiber embedded polishing pad | Kenneth M. Davis, Oscar K. Hsu, Kenneth P. Rodbell, Jean Vangsness | 2007-03-06 |
| 7084479 | Line level air gaps | Stefanie Chiras, Matthew E. Colburn, Timothy J. Dalton, Jeffrey Hedrick, Elbert E. Huang +9 more | 2006-08-01 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin, Steffen K. Kaldor +11 more | 2006-06-20 |
| 7008871 | Selective capping of copper wiring | Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, Mahadevaiyer Krishnan, Wei-Tsu Tseng +1 more | 2006-03-07 |
| 6989117 | Polishing pads with polymer filled fibrous web, and methods for fabricating and using same | Kenneth P. Rodbell, Oscar Chi Hsu, Jean Vangsness, David S. Gilbride, Scott C. Billings +1 more | 2006-01-24 |