Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7358182 | Method of forming an interconnect structure | Shyng-Tsong Chen, Timothy J. Dalton, Nicholas Fuller, Kaushik A. Kumar | 2008-04-15 |
| 7326651 | Method for forming damascene structure utilizing planarizing material coupled with compressive diffusion barrier material | Richard A. Bruff, Richard A. Conti, Allan Upham | 2008-02-05 |