Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6458623 | Conductive adhesive interconnection with insulating polymer carrier | Lewis S. Goldmann, Raymond A. Jackson, Amy B. Ostrander, Charles H. Perry, Brenda Peterson | 2002-10-01 |
| 6429388 | High density column grid array connections and method thereof | Brenda Peterson, Sudipta K. Ray, William E. Sablinski, Amit K. Sarkhel | 2002-08-06 |
| 6360938 | Process and apparatus to remove closely spaced chips on a multi-chip module | Stephen A. DeLaurentis, Raymond A. Jackson, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter | 2002-03-26 |
| 6303400 | Temporary attach article and method for temporary attach of devices to a substrate | Thomas E. Lombardi, Frank L. Pompeo, William E. Sablinski | 2001-10-16 |
| 6302732 | Coaxial connection apparatus and method of attachment | Mark Budman, John U. Knickerbocker | 2001-10-16 |
| 6287126 | Mechanical attachment means used as electrical connection | Michael Berger, Lewis S. Goldmann, Harvey C. Hamel, Marlene W. Moyer, Thomas P. Moyer +1 more | 2001-09-11 |
| 6283359 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Raymond A. Jackson, Gregory B. Martin +3 more | 2001-09-04 |
| 6259155 | Polymer enhanced column grid array | Raymond A. Jackson, Sudipta K. Ray, Paul A. Zucco, Scott R. Dwyer | 2001-07-10 |
| 6235996 | Interconnection structure and process module assembly and rework | Shaji Farooq, Sudipta K. Ray, William E. Sablinski | 2001-05-22 |
| 6216937 | Process and apparatus to remove closely spaced chips on a multi-chip module | Stephen A. DeLaurentis, Raymond A. Jackson, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter | 2001-04-17 |
| 6158644 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Raymond A. Jackson, Gregory B. Martin +3 more | 2000-12-12 |
| 6037193 | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | Laertis Economikos, Lester W. Herron | 2000-03-14 |
| 5990418 | Hermetic CBGA/CCGA structure with thermal paste cooling | Kevin G. Bivona, Jeffrey T. Coffin, Stephen S. Drofitz, Jr., Lewis S. Goldmann, Sushumna Iruvanti +1 more | 1999-11-23 |
| 5945735 | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | Laertis Economikos, Lester W. Herron | 1999-08-31 |
| 5543584 | Structure for repairing electrical lines | Edward F. Handford, Joseph M. Harvilchuck, Raymond A. Jackson, Raj N. Master, Sudipta K. Ray +2 more | 1996-08-06 |
| 5478009 | Selective removal of a single solder ball from an array of solder balls | Laertis Economikos | 1995-12-26 |
| 5425493 | Selective addition of a solder ball to an array of solder balls | Laertis Economikos | 1995-06-20 |
| 5288007 | Apparatus and methods for making simultaneous electrical connections | Michael Berger, Edward F. Handford, Eugene Tas | 1994-02-22 |
| 5243140 | Direct distribution repair and engineering change system | Harsaran S. Bhatia, Suresh D. Kadakia, Shashi D. Malaviya, Mark H. McLeod, Sudipta K. Ray +1 more | 1993-09-07 |
| 5193732 | Apparatus and methods for making simultaneous electrical connections | Michael Berger, Edward F. Handford, Eugene Tas | 1993-03-16 |
| 5153408 | Method and structure for repairing electrical lines | Edward F. Handford, Joseph M. Harvilchuck, Raymond A. Jackson, Raj N. Master, Sudipta K. Ray +2 more | 1992-10-06 |
| 4634638 | High melting point copper-gold-tin brazing alloy for chip carriers | Norman G. Ainslie, Joseph M. Harvilchuck, William J. King, Paul H. Palmateer, John F. Sullivan | 1987-01-06 |