Issued Patents All Time
Showing 51–75 of 139 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10586726 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-03-10 |
| 10573625 | Vertical light emitting diode with magnetic back contact | Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana | 2020-02-25 |
| 10573538 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-02-25 |
| 10559555 | Micro-LED array transfer | Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana | 2020-02-11 |
| 10546836 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Li-Wen Hung, John U. Knickerbocker, Jae-Woong Nah | 2020-01-28 |
| 10522406 | IR assisted fan-out wafer level packaging using silicon handler | Jeffrey D. Gelorme, John U. Knickerbocker | 2019-12-31 |
| 10522383 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Jeffrey D. Gelorme, John U. Knickerbocker | 2019-12-31 |
| 10505160 | Micro-battery using glass package | Qianwen Chen, Yang Liu, Li-Wen Hung | 2019-12-10 |
| 10490525 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Russell A. Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah +1 more | 2019-11-26 |
| 10407791 | Selective solder plating | Qianwen Chen, Yu Luo, Joana Sofia Branquinho Teresa Maria | 2019-09-10 |
| 10393798 | Integrated electro-optical module assembly | Paul S. Andry, Qianwen Chen, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2019-08-27 |
| 10396220 | Device layer thin-film transfer to thermally conductive substrate | John U. Knickerbocker, Steven L. Wright, Cornelia Tsang Yang | 2019-08-27 |
| 10395929 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2019-08-27 |
| 10381255 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2019-08-13 |
| 10361140 | Wafer stacking for integrated circuit manufacturing | Qianwen Chen, John U. Knickerbocker, Joana Sofia Branquinho Teresa Maria | 2019-07-23 |
| 10330701 | Test probe head for full wafer testing | Yu Luo, John U. Knickerbocker, Yang Liu, Steven L. Wright | 2019-06-25 |
| 10325785 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2019-06-18 |
| 10319893 | Magnetically guided chiplet displacement | Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana | 2019-06-11 |
| 10314970 | Drug delivery device having a cavity sealed by a pressurized membrane | John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright | 2019-06-11 |
| 10297479 | Wafer debonding using mid-wavelength infrared radiation ablation | John U. Knickerbocker, Cornelia K. Tsang | 2019-05-21 |
| 10286198 | Microchip medical substance delivery devices | Duixian Liu, Jean-Olivier Plouchart | 2019-05-14 |
| 10243091 | Device layer thin-film transfer to thermally conductive substrate | John U. Knickerbocker, Steven L. Wright, Cornelia Tsang Yang | 2019-03-26 |
| 10229288 | Enhanced data security platform | John U. Knickerbocker, Minhua Lu | 2019-03-12 |
| 10224229 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2019-03-05 |
| 10224219 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2019-03-05 |