Issued Patents All Time
Showing 76–100 of 139 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10217637 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2019-02-26 |
| 10147694 | Direct injection molded solder process for forming solder bumps on wafers | Michael A. Gaynes, Paul A. Lauro, Jae-Woong Nah | 2018-12-04 |
| 10132836 | Method of forming surface protrusions on an article and the article with the protrusions attached | John U. Knickerbocker, Yang Liu, Maurice Mason, Lubomyr T. Romankiw | 2018-11-20 |
| 10115711 | Vertical light emitting diode with magnetic back contact | Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana | 2018-10-30 |
| 10103450 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce, Cornelia K. Tsang | 2018-10-16 |
| 10062622 | Electrolytic seal | Yu Luo | 2018-08-28 |
| 10056310 | Electrolytic seal | Yu Luo | 2018-08-21 |
| 10056672 | Waveguide including first and second metal plates and having a slotted feed to waveguide transition disposed in the first metallic plate | Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia | 2018-08-21 |
| 10038232 | Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit dies | Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia | 2018-07-31 |
| 10032943 | Device layer thin-film transfer to thermally conductive substrate | John U. Knickerbocker, Steven L. Wright, Cornelia Tsang Yang | 2018-07-24 |
| 10033081 | Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application board | Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia | 2018-07-24 |
| 10032973 | Magnetically guided chiplet displacement | Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana | 2018-07-24 |
| 10002856 | Micro-LED array transfer | Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana | 2018-06-19 |
| 9947570 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2018-04-17 |
| 9947567 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Jeffrey D. Gelorme, John U. Knickerbocker | 2018-04-17 |
| 9937124 | Microchip substance delivery devices having low-power electromechanical release mechanisms | S. Jay Chey, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati +2 more | 2018-04-10 |
| 9935009 | IR assisted fan-out wafer level packaging using silicon handler | Jeffrey D. Gelorme, John U. Knickerbocker | 2018-04-03 |
| 9897627 | Test probe substrate | John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang | 2018-02-20 |
| 9893047 | Manufacture of wafer—panel die package assembly technology | John U. Knickerbocker | 2018-02-13 |
| 9867932 | Drug delivery device having a cavity sealed by a pressurized membrane | John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright | 2018-01-16 |
| 9872394 | Substrate via filling | Steven A. Cordes, Sung Kwon Kang, Yu Luo, Peter J. Sorce | 2018-01-16 |
| 9865569 | Planarity-tolerant reworkable interconnect with integrated testing | John U. Knickerbocker, Yang Liu, Yu Luo, Steven L. Wright | 2018-01-09 |
| 9851379 | Test probe substrate | John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang | 2017-12-26 |
| 9820395 | Low cost hermetic micro-electronics | John U. Knickerbocker, Minhua Lu, Jae-Woong Nah, Robert J. Polastre | 2017-11-14 |
| 9798886 | Bio-medical sensing platform | John U. Knickerbocker, Joana Sofia Branquinho Teresa Maria, Sufi Zafar | 2017-10-24 |