Issued Patents All Time
Showing 101–125 of 139 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721864 | Low cost hermetic micro-electronics | John U. Knickerbocker, Minhua Lu, Jae-Woong Nah, Robert J. Polastre | 2017-08-01 |
| 9691747 | Manufacture of wafer—panel die package assembly technology | John U. Knickerbocker | 2017-06-27 |
| 9636783 | Method and apparatus for laser dicing of wafers | Russell A. Budd, John U. Knickerbocker | 2017-05-02 |
| 9636782 | Wafer debonding using mid-wavelength infrared radiation ablation | John U. Knickerbocker, Cornelia K. Tsang | 2017-05-02 |
| 9606142 | Test probe substrate | John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang | 2017-03-28 |
| 9586291 | Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release | John U. Knickerbocker, Eric P. Lewandowski, Cornelia K. Tsang | 2017-03-07 |
| 9537199 | Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips | Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia | 2017-01-03 |
| 9531052 | Semiconductor wafer having an integrated waveguide configured to communicate between first and second integrated circuit dies | Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia | 2016-12-27 |
| 9508566 | Wafer level overmold for three dimensional surfaces | Paul S. Andry, Eric P. Lewandowski, Jae-Woong Nah, Bucknell C. Webb | 2016-11-29 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Michael A. Gaynes, John U. Knickerbocker, Eric P. Lewandowski +2 more | 2016-10-18 |
| 9472859 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce, Cornelia K. Tsang | 2016-10-18 |
| 9433101 | Substrate via filling | Steven A. Cordes, Sung Kwon Kang, Yu Luo, Peter J. Sorce | 2016-08-30 |
| 9391040 | Planarity-tolerant reworkable interconnect with integrated testing | John U. Knickerbocker, Yang Liu, Yu Luo, Steven L. Wright | 2016-07-12 |
| 9364925 | Assembly of electronic and optical devices | Tymon Barwicz | 2016-06-14 |
| 9273408 | Direct injection molded solder process for forming solder bumps on wafers | Michael A. Gaynes, Paul A. Lauro, Jae-Woong Nah | 2016-03-01 |
| 9269561 | Wafer debonding using long-wavelength infrared radiation ablation | John U. Knickerbocker, Cornelia K. Tsang | 2016-02-23 |
| 9200883 | Transferable probe tips | Paul S. Andry, Steven L. Wright | 2015-12-01 |
| 9171749 | Handler wafer removal facilitated by the addition of an amorphous carbon layer on the handler wafer | Sarah H. Knickerbocker, Douglas C. La Tulipe, Jr., Spyridon Skordas, Cornelia K. Tsang, Kevin R. Winstel | 2015-10-27 |
| 9070586 | Method of forming surface protrusions on an article and the article with the protrusions attached | John U. Knickerbocker, Yang Liu, Maurice Mason, Lubomyr T. Romankiw | 2015-06-30 |
| 8927988 | Self-sealed fluidic channels for a nanopore array | Hongbo Peng | 2015-01-06 |
| 8917210 | Package structures to improve on-chip antenna performance | Duixian Liu, Loïc Marnat, Atif Shamim, Cornelia K. Tsang | 2014-12-23 |
| 8912045 | Three dimensional flip chip system and method | Jae-Woong Nah | 2014-12-16 |
| 8752283 | Assembly of electronic and optical devices | Tymon Barwicz | 2014-06-17 |
| 8703274 | Microcavity structure and process | Russell A. Budd, William Graham, Peter A. Gruber, Richard W. Levine, Da-Yuan Shih | 2014-04-22 |
| 8689437 | Method for forming integrated circuit assembly | David Danovitch, Mario J. Interrante, John U. Knickerbocker, Michael J. Shapiro, Van Thanh Truong | 2014-04-08 |