Issued Patents All Time
Showing 1–25 of 139 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12397485 | Camera module and photosensitive assembly thereof | Zhen Huang, Bojie Zhao, Zhewen Mei | 2025-08-26 |
| 12339426 | Optical zoom camera module and assembling method therefor | Mingzhu Wang, Yinli FANG, Chunmei Liu | 2025-06-24 |
| 12332493 | Split camera lens and assembly method thereof, camera module, and terminal device | Zhewen Mei, Haipeng PEI | 2025-06-17 |
| 12298533 | Manufacturing method of a molded photosensitive assembly for an array imaging module | Mingzhu Wang, Bojie Zhao, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2025-05-13 |
| 12204167 | Optical lens, camera module, and assembly method for the optical lens | Liefeng CHEN, Zhewen Mei, Xinxiang SUN, Lin Liu | 2025-01-21 |
| 12119361 | Circuit board assembly with photosensitive element mounted to back side of circuit board | Mingzhu Wang, Nan Guo, Zhenyu Chen, Jingfei He, Zhen Huang +2 more | 2024-10-15 |
| 12117664 | Optical lens, camera module and assembling method | Liefeng CHEN, Lin Liu, Chunmei Liu | 2024-10-15 |
| 12068344 | Molding photosensitive assembly, and camera module and electronic device containing molding photosensitive assembly | Mingzhu Wang, Nan Guo, Zhenyu Chen, Bojie Zhao | 2024-08-20 |
| 12055786 | Lens group assembly, optical lens, camera module and lens group assembling method | Heng Jiang, Lin Liu, Liefeng CHEN | 2024-08-06 |
| 12055783 | Optical lens, camera module and assembly method therefor | Yinli FANG, Heng Jiang, Lin Liu, Shuijia Chu | 2024-08-06 |
| 12041335 | Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module | Mingzhu Wang, Nan Guo, Zhenyu Chen, Bojie Zhao, Feifan Chen +1 more | 2024-07-16 |
| 12035029 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Nan Guo | 2024-07-09 |
| 12035028 | Camera module and photosensitive assembly thereof, electronic device, and manufacturing method | Mingzhu Wang, Zhen Huang, Zhenyu Chen | 2024-07-09 |
| 12021097 | Camera module, and photosensitive component thereof and manufacturing method therefor | Mingzhu Wang, Bojie Zhao, Zhongyu Luan, Zhenyu Chen, Zhen Huang | 2024-06-25 |
| 12022180 | Array camera module and application thereof | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Nan Guo | 2024-06-25 |
| 12010412 | Camera module and photosensitive assembly thereof, electronic device, and manufacturing method | Mingzhu Wang, Xiaodi Liu, Zhen Huang, Zhenyu Chen | 2024-06-11 |
| 11934030 | Optical lens, imaging module and assembly method thereof | Heng Jiang | 2024-03-19 |
| 11881491 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof | Bojie Zhao, Zhewen Mei, Nan Guo | 2024-01-23 |
| 11877044 | Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Nan Guo, Zhenyu Chen, Zhen Huang +2 more | 2024-01-16 |
| 11843009 | Photosensitive assembly, imaging module, smart terminal, and method and mould for manufacturing photosensitive assembly | Zhenyu Chen, Zhewen Mei | 2023-12-12 |
| 11822099 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2023-11-21 |
| 11824071 | Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device | Mingzhu Wang, Zhenyu Chen, Nan Guo, Bojie Zhao, Zhen Huang +2 more | 2023-11-21 |
| 11745401 | Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board | Mingzhu Wang, Bojie Zhao, Zhen Huang | 2023-09-05 |
| 11743569 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Feifan Chen, Qimin Mei, Liang Ding +1 more | 2023-08-29 |
| 11728368 | Semiconductor packaging method and semiconductor device based on molding process | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Heng Jiang, Nan Guo | 2023-08-15 |