Issued Patents All Time
Showing 1–25 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12298533 | Manufacturing method of a molded photosensitive assembly for an array imaging module | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Heng Jiang +4 more | 2025-05-13 |
| 12231759 | Split lens and camera module and electronic apparatus | Mingzhu Wang, Shoujie WANG, Liang Ding, Bojie Zhao, Feifan Chen +2 more | 2025-02-18 |
| 12189202 | Split lens assembly and camera module | Mingzhu Wang, Chunmei Liu, Shoujie WANG, Lifeng YAO, Liang Ding | 2025-01-07 |
| 12189209 | Lens assembly, camera module and method for assembling same | Mingzhu Wang, Lifeng YAO | 2025-01-07 |
| 12189358 | Monitoring method for vibration drilling state of stack structure material | Yan Chen, Chaoren Yan, Yucan Fu, Honghua Su, Jiuhua Xu +1 more | 2025-01-07 |
| 12119361 | Circuit board assembly with photosensitive element mounted to back side of circuit board | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Jingfei He, Zhen Huang +2 more | 2024-10-15 |
| 12105350 | Adjustable optical lens and camera module and manufacturing method and applications thereof | Mingzhu Wang, Bojie Zhao, Heng Jiang, Liang Ding, Feifan Chen +2 more | 2024-10-01 |
| 12068344 | Molding photosensitive assembly, and camera module and electronic device containing molding photosensitive assembly | Mingzhu Wang, Takehiko Tanaka, Zhenyu Chen, Bojie Zhao | 2024-08-20 |
| 12041335 | Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module | Mingzhu Wang, Zhenyu Chen, Bojie Zhao, Takehiko Tanaka, Feifan Chen +1 more | 2024-07-16 |
| 12035029 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Takehiko Tanaka | 2024-07-09 |
| 12022180 | Array camera module and application thereof | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Takehiko Tanaka | 2024-06-25 |
| 11881491 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof | Takehiko Tanaka, Bojie Zhao, Zhewen Mei | 2024-01-23 |
| 11874584 | Lens module and capturing module integrating focusing mechanism and assembly method therefor | Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Hong-Jiang Li +2 more | 2024-01-16 |
| 11877044 | Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Zhen Huang +2 more | 2024-01-16 |
| 11874518 | Camera lens module and manufacturing method thereof | Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Bojie Zhao +1 more | 2024-01-16 |
| 11867965 | Adjustable optical lens and camera module and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Liang Ding, Chunmei Liu, Feifan Chen +1 more | 2024-01-09 |
| 11835784 | Adjustable optical lens and camera module and aligning method thereof | Mingzhu Wang, Bojie Zhao, Liang Ding, Chunmei Liu, Feifan Chen | 2023-12-05 |
| 11824071 | Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device | Mingzhu Wang, Zhenyu Chen, Bojie Zhao, Takehiko Tanaka, Zhen Huang +2 more | 2023-11-21 |
| 11822099 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Heng Jiang +4 more | 2023-11-21 |
| 11785325 | Camera module having circuit board, molded base, and optical lens, electronic device having same and method for manufacturing camera module | Mingzhu Wang, Bojie Zhao, Zhewen Mei, Lifeng YAO, Zhenyu Chen | 2023-10-10 |
| 11729483 | Photosensitive component, and camera module and manufacturing method therefor | Mingzhu Wang, Zhenyu Chen, Zhongyu Luan, Zhen Huang, Fengsheng Xi +5 more | 2023-08-15 |
| 11728368 | Semiconductor packaging method and semiconductor device based on molding process | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Heng Jiang | 2023-08-15 |
| 11721709 | Circuit board assembly with photosensitive element mounted to back side of circuit board | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Jingfei He, Zhen Huang +2 more | 2023-08-08 |
| 11703654 | Camera lens module and manufacturing method thereof | Chunmei Liu, Yiqi Wang, Liang Ding, Mingzhu Wang, Hailong Liao | 2023-07-18 |
| 11664397 | Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof | Takehiko Tanaka, Bojie Zhao, Zhewen Mei | 2023-05-30 |