TN

Tracy E. Napp

IBM: 1 patents #44,794 of 70,183Top 65%
Overall (All Time): #4,043,008 of 4,157,543Top 100%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
4478883 Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate James R. Bupp, Voya R. Markovich, Carlos J. Sambucetti 1984-10-23