Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
MJ

Miguel A. Jimarez — 41 Patents

IBM: 33 patents #2,996 of 70,183Top 5%
ATAmkor Technology: 7 patents #89 of 595Top 15%
Newark Valley, NY: #1 of 49 inventorsTop 3%
New York: #2,549 of 115,490 inventorsTop 3%
Overall (All Time): #76,867 of 4,157,543Top 2%
41 Patents All Time

Issued Patents All Time

Showing 26–41 of 41 patents

Patent #TitleCo-InventorsDate
6497943 Surface metal balancing to reduce chip carrier flexing Lisa J. Jimarez, Mark V. Pierson 2002-12-24
6492600 Laminate having plated microvia interconnects and method for forming the same Ross W. Keesler, Voya R. Markovich, Rajinder S. Rai, Cheryl L. Tytran-Palomaki 2002-12-10
6486415 Compliant layer for encapsulated columns Lisa J. Jimarez, Voya R. Markovich, Cynthia S. Milkovich, Charles H. Perry, Brenda Peterson 2002-11-26
6407334 I/C chip assembly Lisa J. Jimarez 2002-06-18
6337509 Fixture for attaching a conformal chip carrier to a flip chip David N. Cokely, Thomas M. Culnane, Lisa J. Jimarez, Li Li, Donald I. Mead 2002-01-08
6246124 Encapsulated chip module and method of making same Marybeth Perrino, Son K. Tran, Tien Y. Wu 2001-06-12
6223968 Solder bonding/debonding nozzle insert Charles Felix Gabriel, Joseph Edward Zdimal 2001-05-01
6225206 Flip chip C4 extension structure and process Cynthia S. Milkovich, Mark V. Pierson 2001-05-01
6204453 Two signal one power plane circuit board Kenneth Michael Fallon, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more 2001-03-20
6194667 Receptor pad structure for chip carriers Reinaldo Anthony Neira 2001-02-27
6082608 Solder bonding/debonding nozzle insert Charles Felix Gabriel, Joseph Edward Zdimal 2000-07-04
5909838 Method of solder removal Lisa J. Jimarez 1999-06-08
5810241 Solder bonding/debonding nozzle insert Charles Felix Gabriel, Joseph Edward Zdimal 1998-09-22
5729440 Solder hierarchy for chip attachment to substrates Amit K. Sarkhel, Lawrence H. White 1998-03-17
5655703 Solder hierarchy for chip attachment to substrates Amit K. Sarkhel, Lawrence H. White 1997-08-12
5542601 Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate Kenneth Michael Fallon, Joseph Edward Zdimal 1996-08-06