| 9858776 |
Tamper-respondent assembly with nonlinearity monitoring |
Phillip Duane Isaacs |
2018-01-02 |
| 9661747 |
Tamper-respondent assemblies with enclosure-to-board protection |
William L. Brodsky, Edward N. Cohen, Silvio Dragone, Michael J. Fisher, David C. Long +3 more |
2017-05-23 |
| 9554477 |
Tamper-respondent assemblies with enclosure-to-board protection |
William L. Brodsky, Edward N. Cohen, Silvio Dragone, Michael J. Fisher, David C. Long +3 more |
2017-01-24 |
| 8197612 |
Optimization of metallurgical properties of a solder joint |
Minhua Lu, Valerie Oberson, Eric D. Perfecto, Kamalesh K. Srivastava, Brian R. Sundlof +2 more |
2012-06-12 |
| 7795724 |
Sandwiched organic LGA structure |
William L. Brodsky, Bruce J. Chamberlin, Mitchell G. Ferrill, David L. Questad, Robin A. Susko |
2010-09-14 |
| 7709951 |
Thermal pillow |
William L. Brodsky, Peter J. Brofman, Bruce J. Chamberlin, Scott Cummings, David L. Edwards +6 more |
2010-05-04 |
| 7255571 |
Temperature dependent semiconductor module connectors |
William L. Brodsky, Bruce J. Chamberlin, Mitchell G. Ferrill, Robin A. Susko, James R. Wilcox |
2007-08-14 |
| 7137826 |
Temperature dependent semiconductor module connectors |
William L. Brodsky, Bruce J. Chamberlin, Mitchell G. Ferrill, Robin A. Susko, James R. Wilcox |
2006-11-21 |
| 7128579 |
Hook interconnect |
William L. Brodsky, Bruce J. Chamberlin, Mitchell G. Ferrill, Robin A. Susko, James R. Wilcox |
2006-10-31 |
| 6848914 |
Electrical coupling of substrates by conductive buttons |
Brian S. Beaman, William L. Brodsky, Benson Chan, Voya R. Markovich, Charles H. Perry |
2005-02-01 |
| 6514777 |
Built-in inspection template for a printed circuit |
Marshall L. Brown, Raymond Phillips, John Potenza, Jirina D. Shupp, J. Robert Young |
2003-02-04 |
| 6212077 |
Built-in inspection template for a printed circuit |
Marshall L. Brown, Raymond Phillips, John Potenza, Jirina D. Shupp, J. Robert Young |
2001-04-03 |
