Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6703560 | Stress resistant land grid array (LGA) module and method of forming the same | Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering +4 more | 2004-03-09 |
| 6518674 | Temporary attach article and method for temporary attach of devices to a substrate | Mario J. Interrante, Thomas E. Lombardi, William E. Sablinski | 2003-02-11 |
| 6444496 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof | David L. Edwards, Glenn G. Daves, Shaji Farooq, Sushumna Iruvanti | 2002-09-03 |
| 6413353 | Method for direct attachment of a chip to a cooling member | Alain Caron, Jeffrey T. Coffin, Jeffrey A. Zitz | 2002-07-02 |
| 6303400 | Temporary attach article and method for temporary attach of devices to a substrate | Mario J. Interrante, Thomas E. Lombardi, William E. Sablinski | 2001-10-16 |
| 6274214 | Microelectronic package module with temporary lid | Joseph Chan, John B. Pavelka, Hilton T. Toy | 2001-08-14 |
| 6275381 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof | David L. Edwards, Glenn G. Daves, Shaji Farooq, Sushumna Iruvanti | 2001-08-14 |
| 6255139 | Method for providing a thermal path through particles embedded in a thermal cap | David L. Edwards, Patrick A. Coico, Sushumna Iruvanti, Raed A. Sherif, Hilton T. Toy | 2001-07-03 |
| 6111314 | Thermal cap with embedded particles | David L. Edwards, Patrick A. Coico, Sushumna Iruvanti, Raed A. Sherif, Hilton T. Toy | 2000-08-29 |
| 6054008 | Process for adhesively attaching a temporary lid to a microelectronic package | Joseph Chan, John B. Pavelka, Hilton T. Toy | 2000-04-25 |
| 5975409 | Ceramic ball grid array using in-situ solder stretch | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann +5 more | 1999-11-02 |
| 5968670 | Enhanced ceramic ball grid array using in-situ solder stretch with spring | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, James H. Covell, Shaji Farooq +6 more | 1999-10-19 |
| 5964396 | Enhanced ceramic ball grid array using in-situ solder stretch with clip | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann +5 more | 1999-10-12 |
| 5955543 | Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin | Krishna G. Sachdev, Michael Berger, Anson J. Call | 1999-09-21 |
| 5956576 | Enhanced protection of semiconductors with dual surface seal | Hilton T. Toy | 1999-09-21 |
| 5930597 | Reworkable polymer chip encapsulant | Anson J. Call, Stephen L. Buchwalter, Sushumna Iruvanti, Stanley J. Jasne, Paul A. Zucco +1 more | 1999-07-27 |
| 5881945 | Multi-layer solder seal band for semiconductor substrates and process | David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr. +6 more | 1999-03-16 |
| 5881944 | Multi-layer solder seal band for semiconductor substrates | David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr. +6 more | 1999-03-16 |
| 5773561 | Polymer sealants/adhesives and use thereof in electronic package assembly | Krishna G. Sachdev, Michael Berger, Patrick A. Coico | 1998-06-30 |
| 5659203 | Reworkable polymer chip encapsulant | Anson J. Call, Stephen L. Buchwalter, Sushumna Iruvanti, Stanley J. Jasne, Paul A. Zucco +1 more | 1997-08-19 |
| 5560934 | Cleavable diepoxide for removable epoxy compositions | Ali Afzali-Ardakani, Stephen L. Buchwalter, Jeffrey D. Gelorme, Laura L. Kosbar, Bert H. Newman | 1996-10-01 |
| 5533256 | Method for directly joining a chip to a heat sink | Anson J. Call, Stephen H. Meisner, Jeffrey A. Zitz | 1996-07-09 |
| 5512613 | Cleavable diepoxide for removable epoxy compositions | Ali Afzali-Ardakani, Stephen L. Buchwalter, Jeffrey D. Gelorme, Laura L. Kosbar, Bert H. Newman | 1996-04-30 |
| 5471027 | Method for forming chip carrier with a single protective encapsulant | Anson J. Call, Stephen H. Meisner, Jeffrey A. Zitz | 1995-11-28 |