Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
JZ

Jeffrey A. Zitz

IBM: 63 patents #1,225 of 70,183Top 2%
Poughkeepsie, NY: #53 of 1,613 inventorsTop 4%
New York: #1,271 of 115,490 inventorsTop 2%
Overall (All Time): #35,602 of 4,157,543Top 1%
63 Patents All Time

Issued Patents All Time

Showing 51–63 of 63 patents

Patent #TitleCo-InventorsDate
7394659 Apparatus and methods for cooling semiconductor integrated circuit package structures Evan G. Colgan, Gary F. Goth, Deborah Sylvester 2008-07-01
7288839 Apparatus and methods for cooling semiconductor integrated circuit package structures Evan G. Colgan, Jeffrey D. Gelorme, Kamal K. Sikka, Hilton T. Toy 2007-10-30
7250576 Chip package having chip extension and method Evan G. Colgan, David L. Edwards, Benjamin V. Fasano, Kamal K. Sikka, Wei Zou 2007-07-31
6964885 Stress resistant land grid array (LGA) module and method of forming the same Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering +4 more 2005-11-15
6955543 Method and apparatus to form a reworkable seal on an electronic module Gaetano P. Messina, Patrick A. Coico, Lewis S. Goldmann, Richard F. Indyk, Vladimir Jambrih 2005-10-18
6774482 Chip cooling Evan G. Colgan, John Harold Magerlein, Robert L. Wisnieff 2004-08-10
6740959 EMI shielding for semiconductor chip carriers David J. Alcoe, Jeffrey T. Coffin, Michael A. Gaynes, Harvey C. Hamel, Mario J. Interrante +6 more 2004-05-25
6703560 Stress resistant land grid array (LGA) module and method of forming the same Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering +4 more 2004-03-09
6657864 High density thermal solution for direct attach modules Warren D. Dyckman, Edward R. Pillai 2003-12-02
6413353 Method for direct attachment of a chip to a cooling member Frank L. Pompeo, Alain Caron, Jeffrey T. Coffin 2002-07-02
6191480 Universal land grid array socket engagement mechanism Eric J. Kastberg 2001-02-20
5533256 Method for directly joining a chip to a heat sink Anson J. Call, Stephen H. Meisner, Frank L. Pompeo 1996-07-09
5471027 Method for forming chip carrier with a single protective encapsulant Anson J. Call, Stephen H. Meisner, Frank L. Pompeo 1995-11-28