Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583408 | Reducing directional stress in an orthotropic encapsulation member of an electronic package | Marcus E. Interrante, Yi Pan, Hilton T. Toy | 2017-02-28 |
| 9437515 | Heat spreading layer with high thermal conductivity | Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka | 2016-09-06 |
| 9366591 | Determining magnitude of compressive loading | Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng | 2016-06-14 |
| 9153460 | Heatsink attachment module | Evan G. Colgan, Michael A. Gaynes | 2015-10-06 |
| 9105500 | Non-hermetic sealed multi-chip module package | Paul F. Bodenweber, Hilton T. Toy, Krishna R. Tunga | 2015-08-11 |
| 9087834 | Multichip electronic packages and methods of manufacture | Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy | 2015-07-21 |
| 9066460 | Disassemblable electronic assembly with leak-inhibiting coolant capillaries | Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Werner Escher, Ingmar G. Meijer +2 more | 2015-06-23 |
| 8937810 | Electronic assembly with detachable coolant manifold and coolant-cooled electronic module | Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Werner Escher, Ingmar G. Meijer +3 more | 2015-01-20 |
| 8906809 | Multichip electronic packages and methods of manufacture | Martin Beaumier, Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy | 2014-12-09 |
| 8900927 | Multichip electronic packages and methods of manufacture | Martin Beaumier, Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy | 2014-12-02 |
| 8860206 | Multichip electronic packages and methods of manufacture | Kamal K. Sikka, Hilton T. Toy, Krishna R. Tunga | 2014-10-14 |
| 8823164 | Heatsink attachment module | Evan G. Colgan, Michael A. Gaynes | 2014-09-02 |
| 8794079 | Determining magnitude of compressive loading | Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng | 2014-08-05 |
| 8717043 | Determining thermal interface material (TIM) thickness change | Paul F. Bodenweber, Virendra R. Jadhav, Kamal K. Sikka, Jiantao Zheng | 2014-05-06 |
| 8693200 | Semiconductor device cooling module | Evan G. Colgan, Michael A. Gaynes | 2014-04-08 |
| 8592970 | Multichip electronic packages and methods of manufacture | Kamal K. Sikka, Hilton T. Toy, Krishna R. Tunga | 2013-11-26 |
| 8587114 | Multichip electronic packages and methods of manufacture | Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy | 2013-11-19 |
| 8445331 | Multichip electronic packages and methods of manufacture | Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy | 2013-05-21 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Kathryn C. Rivera +3 more | 2011-04-19 |
| 7834442 | Electronic package method and structure with cure-melt hierarchy | Bruce K. Furman, Kenneth C. Marston, Jiantao Zheng | 2010-11-16 |
| 7803664 | Apparatus and methods for cooling semiconductor integrated circuit package structures | Evan G. Colgan, Gary F. Goth, Deborah Sylvester | 2010-09-28 |
| 7768121 | Apparatus and methods for cooling semiconductor integrated circuit package structures | Evan G. Colgan, Jeffrey D. Gelorme, Kamal K. Sikka, Hilton T. Toy | 2010-08-03 |
| 7733655 | Lid edge capping load | Martin Beaumier, Mohamed Belazzouz, Peter J. Brofman, David L. Edwards, Kamal K. Sikka +1 more | 2010-06-08 |
| 7443026 | IC chip package having force-adjustable member between stiffener and printed circuit board | Lewis S. Goldmann | 2008-10-28 |
| 7436057 | Elastomer interposer with voids in a compressive loading system | David C. Long, William L. Brodsky, Jason S. Miller, John G. Torok | 2008-10-14 |