Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8381966 | Flip chip assembly method employing post-contact differential heating | Rajneesh Kumar, Jae-Woong Nah | 2013-02-26 |
| 8197612 | Optimization of metallurgical properties of a solder joint | James A. Busby, Minhua Lu, Valerie Oberson, Kamalesh K. Srivastava, Brian R. Sundlof +2 more | 2012-06-12 |
| 7199450 | Materials and method to seal vias in silicon substrates | Jon A. Casey, Michael Berger, Leena Paivikki Buchwalter, Donald F. Canaperi, Raymond R. Horton +2 more | 2007-04-03 |
| 6998327 | Thin film transfer join process and multilevel thin film module | Jeffrey B. Danielson, Balaram Ghosal, James Kuss, Matthew Oonk, Chandrika Prasad +1 more | 2006-02-14 |
| 6678949 | Process for forming a multi-level thin-film electronic packaging structure | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2004-01-20 |
| 6638374 | Device produced by a process of controlling grain growth in metal films | Patrick W. DeHaven, Charles C. Goldsmith, Jeffery L. Hurd, Suryanarayana Kaja, Michele S. Legere | 2003-10-28 |
| 6459160 | Package with low stress hermetic seal | Lewis S. Goldmann, Raed A. Sherif, William F. Shutler, Hilton T. Toy | 2002-10-01 |
| 6448169 | Apparatus and method for use in manufacturing semiconductor devices | William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra +4 more | 2002-09-10 |
| 6444919 | Thin film wiring scheme utilizing inter-chip site surface wiring | Laertis Economikos, Mukta S. Farooq, Michael F. McAllister, Chandrika Prasad, Keshav Prasad +3 more | 2002-09-03 |
| 6361627 | Process of controlling grain growth in metal films | Patrick W. DeHaven, Charles C. Goldsmith, Jeffery L. Hurd, Suryanarayana Kaja, Michele S. Legere | 2002-03-26 |
| 6342407 | Low stress hermetic seal | Lewis S. Goldmann, Raed A. Sherif, William F. Shutler, Hilton T. Toy | 2002-01-29 |
| 6281452 | Multi-level thin-film electronic packaging structure and related method | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2001-08-28 |
| 6235412 | Corrosion-resistant terminal metal pads for thin film packages | Tien-Jen Cheng, Ajay P. Giri, Ashwani K. Malhotra, John R. Pennacchia, Roy Yu | 2001-05-22 |
| 6183588 | Process for transferring a thin-film structure to a substrate | Kimberley A. Kelly, Ashwani K. Malhotra, Roy Yu | 2001-02-06 |
| 6149048 | Apparatus and method for use in manufacturing semiconductor devices | William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra +4 more | 2000-11-21 |
| 6143117 | Process for transferring a thin-film structure to a temporary carrier | Kimberley A. Kelly, Ashwani K. Malhotra, Roy Yu | 2000-11-07 |
| 6126761 | Process of controlling grain growth in metal films | Patrick W. DeHaven, Charles C. Goldsmith, Jeffrey Louis Hurd, Suryanarayana Kaja, Michele S. Legere | 2000-10-03 |
| 6099935 | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices | William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra +4 more | 2000-08-08 |
| 6083375 | Process for producing corrosion-resistant terminal metal pads for thin film packages | Tien-Jen Cheng, Ajay P. Giri, Ashwani K. Malhotra, John R. Pennacchia, Roy Yu | 2000-07-04 |
| 6036809 | Process for releasing a thin-film structure from a substrate | Kimberley A. Kelly, Ashwani K. Malhotra, Roy Yu | 2000-03-14 |
| 5916451 | Minimal capture pads applied to ceramic vias in ceramic substrates | Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan, George E. White | 1999-06-29 |
| 5898222 | Capped copper electrical interconnects | Mukta S. Farooq, Suryanarayana Kaja, George E. White | 1999-04-27 |
| 5757079 | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure | Michael F. McAllister, James A. McDonald, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins +2 more | 1998-05-26 |
| 5747095 | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages | Michael F. McAllister, James A. McDonald, Keshav Prasad, Gordon J. Robbins, Chandrika Prasad +2 more | 1998-05-05 |
| 5705857 | Capped copper electrical interconnects | Mukta S. Farooq, Suryanarayana Kaja, George E. White | 1998-01-06 |