Issued Patents All Time
Showing 51–58 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5549808 | Method for forming capped copper electrical interconnects | Mukta S. Farooq, Suryanarayana Kaja, George E. White | 1996-08-27 |
| 5545927 | Capped copper electrical interconnects | Mukta S. Farooq, Suryanarayana Kaja, George E. White | 1996-08-13 |
| 5534466 | Method of making area direct transfer multilayer thin film structure | Chandrika Prasad, George E. White, Kwong Hon Wong | 1996-07-09 |
| 5483105 | Module input-output pad having stepped set-back | Suryanarayana Kaja, William H. Price, Sampath Purushothaman, Srinivasa N. Reddy, Vivek M. Sura +1 more | 1996-01-09 |
| 5464682 | Minimal capture pads applied to ceramic vias in ceramic substrates | Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan, George E. White | 1995-11-07 |
| 5436412 | Interconnect structure having improved metallization | Umar M. Ahmad, Ananda H. Kumar, Chandrika Prasad, Sampath Purushothaman, Sudipta K. Ray | 1995-07-25 |
| 5310625 | Process for forming negative tone images of polyimides using base treatment of crosslinked polyamic ester | Marie Angelopoulos, Daniel G. Berger, Jeffrey W. Labadie, Martha I. Sanchez, Sally A. Swanson +1 more | 1994-05-10 |
| 5300403 | Line width control in a radiation sensitive polyimide | Marie Angelopolus, Daniel G. Berger, Peter J. Wilkens | 1994-04-05 |