| 9599664 |
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures |
Mark C. Lamorey, Steven F. Oakland, Janak G. Patel, Kerry P. Pfarr, Peter Slota, Jr. +1 more |
2017-03-21 |
| 9093445 |
Packaging identical chips in a stacked structure |
Evan G. Colgan, Mark C. H. Lamorey, David B. Stone |
2015-07-28 |
| 9057760 |
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures |
Mark C. Lamorey, Steven F. Oakland, Janak G. Patel, Kerry P. Pfarr, Peter Slota, Jr. +1 more |
2015-06-16 |
| 8999846 |
Elongated via structures |
Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr., David B. Stone |
2015-04-07 |
| 8759977 |
Elongated via structures |
Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr., David B. Stone |
2014-06-24 |
| 8653662 |
Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits |
Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr., David B. Stone |
2014-02-18 |
| 8586982 |
Semiconductor test chip device to mimic field thermal mini-cycles to assess reliability |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2013-11-19 |
| 6260163 |
Testing high I/O integrated circuits on a low I/O tester |
Leo A. Noel |
2001-07-10 |
