Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures

Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures

US Patent 9057760 · Granted Jun 16, 2015

Estimated economic value: $2,098,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Heat sink configuration for multi-chip module2023
IC chip package with dummy solder structure under corner, and related method2023
IC chip package with dummy solder structure under corner, and related method2021
Shielded package assemblies with integrated capacitor2021
Shielded package assemblies with integrated capacitor2021
Shielded package assemblies with integrated capacitor2021
Shielded package assemblies with integrated capacitor2021
Interconnected integrated circuit (IC) chip structure and packaging and method o2020
Reduced-warpage laminate structure2020
Reduced-warpage laminate structure2020
Reduced-warpage laminate structure2020
Reduced-warpage laminate structure2020